Direct Diffusion Bonding of Ti3SiC2 and Ti3AlC2

Xiaohui Yin,Meishuan Li,Jingjun Xu,Jie Zhang,Yanchun Zhou

DOI: https://doi.org/10.1016/j.materresbull.2008.12.002

IF: 5.6

2008-01-01

Materials Research Bulletin

Abstract:Two typical layered ternary compounds, Ti3SiC2 and Ti3AlC2, were joined directly by solid-state diffusion bonding method. By various bonding tests at 1100–1300°C for 30–120min under 10–30MPa, and characterizing the microstructure and diffusion reactive phases of the joints by scanning electron microscopy (SEM), energy dispersive X-ray spectrometer (EDS), transmission electron microscopy (TEM) and X-ray diffraction (XRD), the optimal condition for direct joining of Ti3SiC2 and Ti3AlC2 was obtained. Strong joints of Ti3SiC2/Ti3AlC2 can be achieved via diffusion bonding, which is attributed to remarkable interdiffusion of Si and Al at the joint interface. The shear strength of the Ti3SiC2/Ti3AlC2 joints was determined.