Effects of texture orientation in Ti3SiC2 on growth kinetics of interfacial compound layers in diffusion bonded TiAl/Ti3SiC2 joints

Qi Wang,Ming-hao Li,Guo-qing Chen,Xue-song Fu,Wen-long Zhou
DOI: https://doi.org/10.1016/j.jeurceramsoc.2020.09.022
IF: 5.7
2021-01-01
Journal of the European Ceramic Society
Abstract:Adjusting the growth kinetics of the interfacial compound layers may be a feasible way to enhance joint properties or service performance. In this study, the textured Ti3SiC2 was obtained by hot-deforming the sintered Ti3SiC2 (TSC), and the effects of the texture orientation on the interfacial microstructural evolution and growth kinetics of the interfacial compounds in the diffusion bonded TiAl/Ti3SiC2 joints were investigated. The texture orientation of Ti3SiC2 had little effect on the interfacial microstructural evolution but had a significant effect on the growth kinetics. When bonded at the same temperature, the growth rate of the interfacial compound layers in the TiAl/TSC ∥ joint (TSC ∥ , TSC ⊥ : Ti3SiC2 with [0001] texture orientation parallel, perpendicular to the bonded seam) was fastest; which was slowest in the TiAl/TSC ⊥ joint and was in the middle in the TiAl/TSC joint. The highest shear strengths of the three different joints were similar (about 54 MPa).
materials science, ceramics
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