Growth of WSi 2 in Phosphorous-Implanted W/«Si» Couples

E. Ma,B. S. Lim,M-A. Nicolet,N. S. Alvi,A. H. Hamdi
DOI: https://doi.org/10.1007/bf02652179
IF: 2.1
1988-01-01
Journal of Electronic Materials
Abstract:The thermal reaction of rf-sputter-deposited tungsten films with a (100) silicon substrate is investigated by vacuum furnace annealing and rapid thermal annealing. An irradiation of the W/Si interface by a phosphorous ion beam at room temperature prior to annealing promotes a uniform interfacial growth of WSi2. The growth of WSi2 follows diffusion-controlled kinetics during both furnace annealing and rapid thermal processing. A growth law of x2 = kt is obtained for furnace annealing between 690 and 740° C, where x is the thickness of the compound, t is the annealing duration after an initial incubation period and k = 62 (cm2/s) exp (−-3.0 eV/kT). The surface smoothness of the suicide films improves with increasing ion dose.
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