Abstract:The upcoming High-Luminosity running phase of the LHC will require a complete replacement of the current tracking system in the CMS experiment. With the planned integrated luminosity of up to 4000Â fb âˆ’1 to be delivered to the experiments, the innermost layers of the CMS Inner Tracker (IT) will face particle fluences of up to a non-ionizing energy loss (NIEL) of Î¦eq Â =Â 3.5Â Ã— Â 10 16 Â cm âˆ’2 . Through an extensive R&D program involving multiple vendors, several pixel sensor options have been thoroughly evaluated, considering different pixel pitches and sensor cell designs. Recently, the final choices have been made. All layers, except the innermost layer of the barrel section of the IT, will be equipped with planar n-in-p sensors featuring an active thickness of 150Î1⁄4m and pixel pitches of 25Â Ã— Â 100Î1⁄4m 2 . During the initial phase of the sensor qualification campaign, the sensors were coupled with demonstrator chips (RD53A), and the modules were exposed to fluences of up to Î¦eq Â =Â 2.0Â Ã— Â 10 16 Â cm âˆ’2 , undergoing comprehensive testing at both CERN and DESY test beam facilities. In 2023, single chip assemblies, along with the first full modules incorporating the final, full-size prototype readout chip (RD53B-CMS) irradiated up to Î¦eq Â =Â 1.0Â Ã— Â 10 16 Â cm âˆ’2 , have become available and were tested at DESY. In this article, an overview of the preliminary test beam results will be provided. The studies will cover hit efficiency, spatial resolution, and noise hit occupancy for both non-irradiated samples and irradiated assemblies. The preliminary findings are in line with previous results obtained with RD53A assemblies. The measurements described in this contribution paved the way for the submission of the final readout chip and kickoff batches for planar production sensors for the Inner Tracker that have been launched recently.

Radiation experience with the CMS pixel detector

Operation and performance of the CMS tracker

Signal height in silicon pixel detectors irradiated with pions and protons

Test beam results of irradiated modules for the CMS Phase-2 upgrade equipped with HPK planar pixel sensors and RD53B-CMS readout chips

Radiation hardness study on a CMOS pixel sensor for charged particle tracking

Performance verification of the CMS Phase-1 Upgrade Pixel detector

Beam Test Results of the US-CMS Forward Pixel Detector

Measurement of the fractional radiation length of a pixel module for the CMS Phase-2 upgrade via the multiple scattering of positrons

Microscopic Characterisation of Photo Detectors from CMS Hadron Calorimeter

3D silicon pixel sensors for the CMS experiment tracker upgrade

The CMS Phase-1 Pixel Detector Upgrade

Position resolution with 25 um pitch pixel sensors before and after irradiation

Mighty Tracker -- Performance Studies of the MightyPix for LHCb

Radiation hardness studies of AMS HV-CMOS 350 nm prototype chip HVStripV1

Evaluation of Planar Silicon Pixel Sensors with the RD53A Readout Chip for the Phase-2 Upgrade of the CMS Inner Tracker

CMS Pixel Detector Upgrade

Electrical characterization of AMS aH18 HV-CMOS after neutrons and protons irradiation

Characterisation of 3D trench silicon pixel sensors irradiated at 1⋅1017 1 MeV neqcm-2

Fluence Dependence of Charge Collection of irradiated Pixel Sensors

Status of the CMS Phase I Pixel Detector Upgrade

Sensor response and radiation damage effects for 3D pixels in the ATLAS IBL Detector