Numerical modeling and optimization of fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly
Rilwan Kayode Apalowo,Muhamed Abdul Fatah Muhamed Mukhtar,Mohamad Aizat Abas,Fakhrozi Che Ani
DOI: https://doi.org/10.1108/ssmt-04-2024-0020
IF: 1.494
2024-09-27
Soldering & Surface Mount Technology
Abstract:Purpose This study aims to investigate the design configuration for an optimum solder height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Design/methodology/approach A multiphase finite volume model is developed for reflow soldering simulations to determine the fillet height of reinforced SAC305 solder joint in an ultra-fine capacitor assembly. Different solders, namely SAC305-x, SAC305-xNiO and SAC305-xTi, with varying percentage weight compositions of nanoparticles (x = 0 Wt.%, 0.01 Wt.%, 0.05 Wt.%, 0.10 Wt.%, 0.15 Wt.%) are investigated. A reflow soldering experiment is also conducted, and the cross-sections of the reflowed packages are examined using a High-Resolution Transmission Electron Microscope (HRTEM). The optimum design configurations (nanoparticle composition and material) for the solder fillet height are investigated using the Taguchi orthogonal array method. Findings Good correlations were recorded between the HRTEM micrographs and the numerical predictions of the nanoparticles' distribution in the molten solder. The numerical prediction of the fillet height also agrees with the experiment, with a maximum disparity of 5.43%. It was found that Ti nanoparticles, having the smallest density compared to NiO and, exhibit the highest buoyancy effect in the molten solder. The Taguchi analysis revealed that the nanoparticles' material factor is more significant than the Wt.% factor for an optimum fillet height. An optimum design configuration for fillet height was established as SAC 305–0.15 Wt.% Ti, corresponding to a 41.13% improvement of the plain SAC 305 solder. Practical implications The fillet height of solder joints greatly influences the solder joint reliability of miniaturized electronic packages. Solder joint reliability of ultra-fine capacitors can be improved using this study's findings on the optimum design configuration for the capacitor's solder fillet. The study's findings can be practically implemented in industries such as electronics manufacturing, where enhanced solder joint reliability is critical. Originality/value Investigation of the optimum design configuration for reinforced SAC305 solder fillet is almost nonexistent in the literature. This study explored the optimization of fillet height of reinforced SAC305 solder joints in miniaturized capacitor assembly.
materials science, multidisciplinary,engineering, electrical & electronic,metallurgy & metallurgical engineering, manufacturing