Abstract:The mechanical properties of Cu-Ti alloys have been characterized extensively through experimental studies. However, a detailed understanding of why the strength of Cu increases after a small fraction of Ti atoms is added to the alloy is still missing. In this work, we address this question using density functional theory (DFT) and molecular dynamics (MD) simulations with modified embedded atom method (MEAM) interatomic potentials. First, we performed calculations of uniaxial tension deformations of small bicrystalline Cu cells using DFT static simulations. We then carried out uniaxial tension deformations on much larger bicrystalline and polycrystalline Cu cells using MEAM MD simulations. In bicrystalline Cu, the inclusion of Ti increases the grain boundary separation energy and maximum tensile stress. The DFT calculations demonstrate that the increase in tensile stress can be attributed to an increase in the local charge density arising from Ti. MEAM simulations in larger bicrystalline systems have shown that increasing the Ti concentration decreases the density of stacking faults. This observation is enhanced in polycrystalline Cu, where the addition of Ti atoms, even at concentrations as low as 1.5 at.%, increases the yield strength and elastic modulus of the material compared to pure Cu. Under uniaxial tensile loading, the addition of small amounts of Ti hinders the formation of partial Shockley dislocations in the grain boundaries of Cu, leading to reduced local deformation. These results shed light on the role of Ti in determining the mechanical properties of polycrystalline Cu and will enable the engineering of grain boundaries and the inclusion of Ti to improve degradation resistance.

Strengthening caused by precipitates with different morphologies in Cu–Cr–Ti alloys: The role of dislocation bending angle

Strong Deformation Anisotropies of Ω-Precipitates and Strengthening Mechanisms in Ti-10V-2Fe-3Al Alloy Micropillars: Precipitates Shearing Vs Precipitates Disordering

Nanoprecipitates Induced Dislocation Pinning and Multiplication Strategy for Designing High Strength, Plasticity and Conductivity Cu Alloys

The Role of In-Situ Al3Ti Formed During Solidification in Improving the High-Temperature Properties of Al-Cu Alloy

Effect of micro-alloying element Ti on mechanical properties of Cu–Cr alloy

Modeling the effects of varying Ti concentration on the mechanical properties of Cu-Ti alloys

Strength properties and enhanced plasticity of intermetallic TiAl(CrSi) alloys

Crystallography and diffraction patterns of the precipitates in Cu-3 wt% Ti alloy

Strengthening the grain boundary of Mo alloy via little TiC addition

Effect of temperature on mechanical behavior of Cu–Cr–Co–Ti alloys

Influence of Dislocation Morphology on T1 Precipitation of an Al-Cu-Li Alloy

Designing ultra-strong and ductile hierarchical titanium alloys via interstitial solute-mediated multi-morphologic α-nanoprecipitates

Investigation of the mechanical properties of TiC particle-reinforced Al-Cu alloys: insights into interface precipitation mechanisms and strengthening effects

Achieving high strength and large ductility in a Cr30Co30Ni30Al5Ti5 alloy through intergranular precipitation

Enhanced tensile properties in a Cu-Al2O3 alloy via trace Ti addition

Revealing the Local Lattice Strains and Strengthening Mechanisms of Ti Alloys

Design of Cu–Cr Alloys with High Strength and High Ductility Based on First-Principles Calculations

Improving strength and elongation of laser directed energy deposited Cu-Nb alloy via Ti addition

Simultaneously Improved the Strength and Ductility of Cast Al-3Li-2Cu Alloy by Ti Addition and Heat Treatment

An Investigation on the Compressive Strength Enhancing Mechanism of Directionally Solidified Ti-47Al-2Nb-2Cr-0.2Er Alloy in Case of Cyclic Loading

Enhanced strength-ductility synergy in CuSn alloy via tuning Ti content