Grain boundary passivation in cuprous oxide thin films via nitrogen annealing

Jiangyiming Jiang,Jiannan Zhang,Yang Chen,Haoming Wei,Yun Tian
DOI: https://doi.org/10.1016/j.mssp.2023.108028
IF: 4.1
2023-12-06
Materials Science in Semiconductor Processing
Abstract:In this work, polycrystalline cuprous oxide (Cu 2 O) films deposited by magnetron sputtering were annealed in situ in N 2 atmospheres. Room-temperature and temperature-dependent Hall-effect measurements were performed on as-deposited and N 2 -annealed Cu 2 O films to probe the electrical transport mechanisms. The results show that the hole mobility of 0.8 Pa N 2 -annealed Cu 2 O film is enhanced compared with its as-deposited counterpart. It is shown that at low temperatures, the hole mobilities of Cu 2 O films appear to be limited by grain boundary scattering, while acoustic-phonon scattering comes into play at elevated temperatures. Moreover, the grain boundary potential barrier height which inhibits the hole transport is found to be reduced by N 2 -annealing at 0.8 Pa, thereby leading to the observed improvement in the hole mobility. It is thought that N 2 is mainly concentrated at the grain boundaries in polycrystalline Cu 2 O films, thus passivating the grain boundary defect trap states. The results reported in this work suggest that N 2 -annealing induced grain boundary passivation could be an effective method to improve the photoelectric properties of polycrystalline Cu 2 O films.
engineering, electrical & electronic,materials science, multidisciplinary,physics, condensed matter, applied
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