Performance Assessment of High-k SOI GaN FinFET with Different Fin Aspect Ratio for RF/Wireless Applications

Vandana Singh Rajawat,Bharat Choudhary,Ajay Kumar
DOI: https://doi.org/10.1007/s11277-024-11293-y
IF: 2.017
2024-06-26
Wireless Personal Communications
Abstract:This paper proposes High-k SOI GaN FinFET which is a potential candidate for more efficient and high-performance electronic devices attributable to high carrier mobility and high breakdown voltage of GaN. Further, optimization of fin aspect ratio of High-k SOI GaN FinFET is done, keeping conducting channel area constant for enhanced linear and intermodulation distortion performance. The better linearity and intermodulation distortion parameters are essential for optimized and efficient performance of the device in RF/wireless applications. This paper presents three different configurations for High-k SOI GaN FinFET that are C1, C2 and C3 with fin aspect ratio of 1.67, 2.4, 3.75 respectively, having the same conducting channel area to optimize the linear and intermodulation distortion performance for RF/wireless applications. The investigation has been focused on the linearity and intermodulation distortion performance through exploration of 1-dB compression point, Voltage Intercept Points (VIP2 & VIP3), IIP3, IMD3, second & third Harmonic Distortion (HD2, HD3), etc. for all the three configurations. The results conclude that decrease in fin aspect ratio reduces the distortion and improves the linearity of the device for RF applications. Cut-off frequency ( f T ) and maximum oscillation frequency ( f max ) are also calculated for C1, C2 and C3. C1 configuration has highest f T and f max which makes it suitable for RF applications. By these findings, it would be helpful to design 3-D devices that can be used in wireless communication system, electric vehicles, Internet of Things (IoT) devices and power electronics.
telecommunications
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