Abstract:Given the lightweight nature and excellent thermal conductivity of aluminum, it offers significant potential for light-weighting of phase-change cooling components. To further enhance the thermal performance of aluminumbased vapor chambers, this study utilized selective laser melting (SLM) to design and integrally manufacture the slightly oleophilic wick for the condenser of the aluminum-based vapor chamber, along with three different superoleophilic wick structures for the evaporator: the gyroid bionic composite porous wick vapor chamber (GBCPVC), the groove composite porous wick vapor chamber (GCPVC), and the uniform porous wick vapor chamber (UPVC). A water-cooling experimental setup was established, and the effects of wick structure, cooling water flow rate, and cooling water temperature on the maximum heat load, temperature uniformity, and thermal resistance of vapor chambers were systematically investigated. The results indicated that the gyroid bionic porous wick structure significantly enhanced the thermal performance of the vapor chamber. Under the same conditions, GBCPVC exhibited lower thermal resistance and superior temperature uniformity, achieving a higher heat load than GCPVC and UPVC. When the cooling water temperature was decreased, its maximum heat load significantly increased. Specifically, at 15 degrees C, the maximum heat load for GBCPVC reached 300 W, an increase of 33.33 % and 53.33 % compared to 25 degrees C and 35 degrees C, respectively. Conversely, a rise in cooling water temperature enhanced the temperature uniformity and reduced thermal resistance of CBCPVC. At 35 degrees C and a heat load of 120 W, GBCPVC achieved a minimum thermal resistance of 0.034 K/W and a maximum temperature difference of 1.46 degrees C. Additionally, an increased flow rate enhanced the maximum heat load of GBCPVC, and under high heat loads, it could also reduce the thermal resistance and improve temperature uniformity. This study provides new insights and solutions for the thermal management of phase-change cooling components in aerospace electronic devices.

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