A built-in self-repair design for RAMs with 2-D redundancy

Jin-Fu Li,Jen-Chieh Yeh,Rei-Fu Huang,Cheng-Wen Wu,J.-C. Yeh
DOI: https://doi.org/10.1109/tvlsi.2005.848824
2005-06-01
IEEE Transactions on Very Large Scale Integration (VLSI) Systems
Abstract:This brief presents a built-in self-repair (BISR) scheme for semiconductor memories with two–dimensional (2-D) redundancy structures, i.e., spare rows and spare columns. The BISR design is composed of a built-in self-test module and a built-in redundancy analysis (BIRA) module. The BIRA module executes the proposed RA algorithm for RAM with a 2-D redundancy structure. The BIRA module also serves as the reconfiguration unit in the normal mode. Experimental results show that a high repair rate (i.e., the ratio of the number of repaired memories to the number of defective memories) is achieved with the BISR scheme. The BISR circuit has a low area overhead—about 4.6% for an 8 K × 64 SRAM.
engineering, electrical & electronic,computer science, hardware & architecture
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