Abstract:The thermal degradation behaviors of phenylethynyl-terminated polyimide and their carbon fiber reinforced composites (CFRC) are significant to be evaluated comprehensively as their high-temperature applications are gradually expanded. It is found that ether-containing thermoset polyimide (PI) film shows unique degradation behaviors near glass transition temperature ( T g ). Though the triethylamine (Et 3 N) chemical imidization method is applied, the PI backbone shows thermal stability at 371°C thermo-oxidation condition and the main degradation parts site at the curing structure. More aliphatic (C-C) linkages will be formed in the thermo-oxidation process and they are ascribed to the further crosslinking behaviors of polyene structure. However, the PI film shows stable mechanical properties after thermo-oxidation. Meanwhile, the formation of an amorphous carbon structure is found after thermo-oxidation treatment, which endows the composite with enhanced electrical properties. Though the micro-cracking phenomenon happens at the matrix/CF interface of composite surface and thus degrades its mechanical properties, the in-plane longitudinal and transverse conductivity of the composite perform an increase, factors of 1.13 to 2.56×10 4 S/m and 2.28 to 454.8 S/m, respectively. Mechanism study indicates that the formation of amorphous carbon components is caused by the structural rearrangement of the degrading polyene curing structure and becomes more in the thermo-oxidation process, not affecting the backbone integrity and mechanical stability of the PI matrix. As a result, thermo-oxidation treatment degrades the mechanical properties of the composite, whereas the formed amorphous carbon component acts as a self-growing carbon-based nano-filling structure at the PI/CF interface and enhances the electrical contact of the carbon fibers.

Clarifying the effect of moisture absorption and high-temperature thermal aging on structure and properties of polyimide film at molecular dynamic level

Moisture absorption and hydrothermal aging of phenylethynyl-terminated pyromellitic dianhydride-type asymmetric polyimide and composites

Dielectric Property and Charge Evolution Behavior in Thermally Aged Polyimide Films

Modification of Polyimide Films by Copolymerization and Blending

Characterization and Thermal Degradation of Polyimide Derived from 5-Amino-2(p-aminophenyl) Benzoxazole Monomer with Pyromellitic Dianhydride

Conduction Current Characteristics of Thermally Aged Polyimide Films Based on Physico-chemical Analysis

Mechanical, Dielectric, and Thermal Attributes of Polyimides Stemmed Out of 4, 4’–Diaminodiphenyl Ether

Polymerization, Structure and Thermal Properties of Odpa-Dmb Polyimide Films

Effects of pre-imidization on rheological behaviors of polyamic acid solution and thermal mechanical properties of polyimide film: an experiment and molecular dynamics simulation

Infrared-Analysis Of The Irradiation Effects In Aromatic Polyimide Films

Effect of Isomerism on Mechanical and Tribological Properties of Thermoplastic Polyimide Films

Preparation of High-Temperature Resistant Polyimide Fibers by Introducing the p -Phenylenediamine into Kapton-Type Polyimide

Influences of Elevated Temperature and Humidity on Breakdown Characteristics of Polyimide Film

Effect of Water Absorption on Electric Properties of Temperature-Resistant Polymers

StudyonDielectric Behaviors Ofpmma During Thermal Aging

Effect of high-temperature thermo-oxidation on the mechanical and electrical properties of phenylethynyl-terminated polyimide/carbon fiber composite

Synthesis and Characterization of Polyimide from Hydrogenated Pyromellitic Anhydride

Effects of Thermal Treatments and Dendrimers Chemical Structures on the Properties of Highly Surface Cross-Linked Polyimide Films

Thermal Degradation Mechanism and Thermal Mechanical Properties of Two High-Performance Aromatic Polyimide Fibers

Structure and Properties of Thermoplastic Polyimide Based on 4', 4'-(Oxybis (methylene)) Bis ([1.1'- Bipheny]3-Amine) Diamine

Molecular Design, Synthesis and Characterization of Intrinsically Black Polyimide Films with High Thermal Stability and Good Electrical Properties