Performance of SOI Pixel Sensors Developed for X-ray Astronomy
Takaaki Tanaka,Takeshi Go Tsuru,Hiroyuki Uchida,Sodai Harada,Tomoyuki Okuno,Kazuho Kayama,Yuki Amano,Hideaki Matsumura,Ayaki Takeda,Koji Mori,Yusuke Nishioka,Kohei Fukuda,Takahiro Hida,Masataka Yukumoto,Yasuo Arai,Ikuo Kurachi,Shoji Kawahito,Keiichiro Kagawa,Keita Yasutomi,Sumeet Shrestha,Syunta Nakanishi,Hiroki Kamehama,Takayoshi Kohmura,Kouichi Hagino,Kousuke Negishi,Kenji Oono,Keigo Yarita
DOI: https://doi.org/10.48550/arXiv.1812.05803
2018-12-14
Abstract:We have been developing monolithic active pixel sensors for X-rays based on the silicon-on-insulator technology. Our device consists of a low-resistivity Si layer for readout CMOS electronics, a high-resistivity Si sensor layer, and a SiO$_2$ layer between them. This configuration allows us both high-speed readout circuits and a thick (on the order of $100~\mu{\rm m}$) depletion layer in a monolithic device. Each pixel circuit contains a trigger output function, with which we can achieve a time resolution of $\lesssim 10~\mu{\rm s}$. One of our key development items is improvement of the energy resolution. We recently fabricated a device named XRPIX6E, to which we introduced a pinned depleted diode (PDD) structure. The structure reduces the capacitance coupling between the sensing area in the sensor layer and the pixel circuit, which degrades the spectral performance. With XRPIX6E, we achieve an energy resolution of $\sim 150$~eV in full width at half maximum for 6.4-keV X-rays. In addition to the good energy resolution, a large imaging area is required for practical use. We developed and tested XRPIX5b, which has an imaging area size of $21.9~{\rm mm} \times 13.8~{\rm mm}$ and is the largest device that we ever fabricated. We successfully obtain X-ray data from almost all the $608 \times 384$ pixels with high uniformity.
Instrumentation and Methods for Astrophysics,Instrumentation and Detectors