Dynamic evolution of internal stress, grain growth, and crystallographic texture in arc-evaporated AlTiN thin films using in-situ synchrotron x-ray diffraction

Sanjay Nayak,Tun-Wei Hsu,Robert Boyd,Jens Gibmeier,Norbert Schell,Jens Birch,Lina Rogström,Magnus Odén

2023-12-21

Abstract:Understanding the nucleation and growth of polycrystalline thin films is a long-standing goal. Polycrystalline films have many grains with different orientations that affect thin-film properties. Numerous studies have been done to determine these grain size and their preferred crystallographic orientation as well as stress in films. However most past studies have either employed an ex-situ methodology or only monitor the development of macroscopic stress in real-time. There has never been any research done on the simultaneous determination of crystallographic texture, grain size, and microscopic stress in polycrystalline thin films. In this study, we simultaneously monitored the generation and temporal evolution of texture, grain size, and internal stress in cathodic arc evaporated Al0.50Ti0.50N thin films using a bespoke deposition apparatus designed for use with 2-dimensional synchrotron x-ray diffraction technique. The influence of the substrate temperature is investigated in terms of the emergence and development of texture, grain size and stress evolution. A dynamic evolution of the crystallographic texture is observed as the overall film thickness varies. We clearly resolved two regime of films growth based on stress evolution. Beyond a threshold grain size (~ 14 nm), the stress scales inversely to the average grain sizes, and as the film thickness increases, immediate compressive stress relaxation was seen. An extensive ex-situ evaluation of thin films using electron microscopies and electron diffraction was performed to support the in-situ x-ray diffraction results.

Materials Science

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to understand the dynamic evolution processes of grain growth, crystallographic texture and internal stress in Al\(_{0.50}\)Ti\(_{0.50}\)N thin films prepared by cathodic arc evaporation deposition at different substrate temperatures. Specifically, the researchers hope to monitor in real - time the changes in the microstructure (such as grain size, crystallographic texture) and stress state of these thin films during the growth process by in - situ synchrotron radiation X - ray diffraction technology, so as to reveal the relationship between these properties and the substrate temperature. This not only helps to deeply understand the growth mechanism of thin - film materials, but also provides a theoretical basis for optimizing the performance of thin films, especially for improving the mechanical properties and stability of thin films in industrial applications.

The paper mentions that although past studies have explored the characteristics such as grain size, preferred crystallographic orientation and stress of thin films, most of the studies either adopted off - line methods or only monitored the real - time development of macro - stress. However, this study has for the first time achieved the simultaneous determination of crystallographic texture, grain size and micro - stress in polycrystalline thin films, and in particular, has carried out a detailed analysis of the dynamic changes of Al\(_{0.50}\)Ti\(_{0.50}\)N thin films during the cathodic arc evaporation deposition process. Through this study, the authors hope to fill this gap in this field and provide new insights for the future design and manufacture of high - performance thin - film materials.