Heat-curable epoxy resin composition for optical semiconductor element encapsulation and optical semiconductor device using same

富田忠,堤吉弘
Abstract:Provided are a heat-curable epoxy resin composition with a superior handling property, transparency and crack resistance; and an optical semiconductor device having an optical semiconductor element encapsulated by such composition. The composition includes: (A) a prepolymer obtained by a reaction of (A-1), (A-2), (A-3) and (A-4) at an epoxy group equivalent/acid anhydride group equivalent ratio of 0.6 to 2.0, (A-1) being a triazine derivative epoxy resin, (A-2) being at least one selected from the group consisting of a bisphenol A-type epoxy resin, a bisphenol F-type epoxy resin, a hydrogenated bisphenol A-type epoxy resin and an alicyclic epoxy resin, (A-3) being an acid anhydride curing agent as a liquid at 50 DEG C., and (A-4) being a flexibility imparting agent selected from the group consisting of a polycaprolactone polyol, a polycarbonate polyol and an acrylic block copolymer; and (B) a curing accelerator comprised of an onium salt represented by: X+Y- (1) wherein X+ represents a cation, and Y- represents an anion.
Engineering,Materials Science
What problem does this paper attempt to address?