Low dielectric constant and highly intrinsic thermal conductivity fluorine‐containing epoxy resins with ordered liquid crystal structures
Xuerong Fan,Zheng Liu,Shuangshuang Wang,Junwei Gu
DOI: https://doi.org/10.1002/sus2.172
2023-12-09
SusMat
Abstract:A novel fluorine‐containing liquid crystal epoxy cured resins (TFSAEy/DDM) have the optimal comprehensive properties, such as a low ε value, highly intrinsic λ value, excellent mechanical properties, outstanding heat resistance, wear resistance and flame retardancy, which would replace conventional epoxy resins (E‐51/DDM) in the high‐heating electronic component packaging and printed circuit boards. Epoxy resins with a high dielectric constant and low intrinsic thermal conductivity coefficient cannot meet the current application requirements of advanced electronic and electrical equipment. Therefore, novel fluorine‐containing liquid crystal epoxy compounds (TFSAEy) with fluorinated groups, biphenyl units, and flexible alkyl chains are first synthesized via amidation and esterification reactions. Then, 4,4′‐diaminodiphenylmethane (DDM) is used as a curing agent to prepare the corresponding fluorine‐containing liquid crystal epoxy resins. The obtained dielectric constant (ε) and dielectric loss (tan δ) values of TFSAEy/DDM at 1 MHz are 2.54 and 0.025, respectively, which are significantly lower than those of conventional epoxy resins (E‐51/DDM, 3.52 and 0.038). Additionally, the intrinsic thermal conductivity coefficient (λ) of TFSAEy/DDM is 0.36 W/(m·K), 71.4% higher than that of E‐51/DDM (0.21 W/(m·K)). Meanwhile, the corresponding elastic modulus, hardness, glass transition temperature, and heat resistance index of TFSAEy/DDM are 5.73 GPa, 0.35 GPa, 213.5°C, and 188.7°C, respectively, all superior to those of E‐51/DDM (3.68 GPa, 0.27 GPa, 107.2°C, and 174.8°C), presenting potential application in high‐heating electronic component packaging and printed circuit boards.