Embedded Magnetic Solenoid Inductor into Organic Packaging Substrate Using Lithographic Via Technology for Power Supply Module Integration
Weihao Zhang,Guoyun Zhou,Qi Gao,Wei Jia,Xianming Chen,Benxia Huang,Lei Feng,Wei He,Chong Wang,Yongkang Zhu
DOI: https://doi.org/10.1109/ted.2022.3188592
IF: 3.1
2022-01-01
IEEE Transactions on Electron Devices
Abstract:In this article, an embedded magnetic solenoid inductor into an organic packaging substrate is implemented based on lithographically defined vias with a semiadditive process flow. In this solenoid inductor, the solid vertical interconnects and magnetic composite core are simultaneously utilized, both significantly reducing dc resistance and boosting inductance per unit area. A small-signal electrical test of the microinductor shows greatly improved performance including a flat dc inductance of 41.9 nH, low dc resistance of 60 $\text{m}\Omega $ , a peak quality of 42.7 at 92.8 MHz, and a high 10% saturation current of 3.81 A with a footprint area of 5.7 mm 2 . Consequently, the microinductor fabricated achieves a high inductance to resistance ratio of 0.7 nH/ $\text{m}\Omega $ . Therefore, the proposed inductor achieves a superior ${Q}$ -factor of 42.7 that is the highest reported value for a solenoid magnetic power inductor with this prior art. The calculated peak effective inductor efficiency is 98.11% for 3.6- to 1-V, 100-MHz dc–dc conversion.