Multiple-response surface optimization of IMCs layer in Au–Sn laser transmission bonding process

Narttakarn Khunjun,Nikorn Sirivongpaisal,Panuwat Rodchom,Jakawat Deeying

DOI: https://doi.org/10.1007/s00170-024-14633-1

IF: 3.563

2024-11-10

The International Journal of Advanced Manufacturing Technology

Abstract:The focus of the research is the laser bonding process that joins the laser diode silicon chip with the head gimbal assembly (HGA) slider in the hard disk drive. This study introduces a new technique for Au–Sn bonding using continuous wave (CW) laser transmission. The laser beam is transmitted through a quartz crystal to heat Alumina titanium carbide (AlTiC). The absorbed laser energy melts the Au–Sn substrates, effectively joining them. Key quality characteristics for ensuring bond quality and long-term reliability include shear strength, pitch angle, and gap of the bonded joint. A central composite rotatable design (CCRD) was used to investigate the influence of process parameters such as y-stage position, x-stage position, laser power, bonding time, and bonding force on quality characteristics. Multi-response surface optimization was then carried out to achieve optimal settings for all these characteristics simultaneously. The optimal process parameters were determined to be y-stage at − 0.0166°, X-stage at − 0.0660°, laser power at 3.8 W, time at 245 ms, and force at 13 kgf. Finally, empirical model validation was performed, resulting in slight differences between the predicted and actual values of shear strength, pitch angle, and gap, which were 2.00%, 3.70%, and 0.09%, respectively.

engineering, manufacturing,automation & control systems