Depth profiling of the Si ion implantation induced disorder and strain in 4H-SiC and the thermal annealing recovery

Gaurav Gupta,Przemyslaw Jozwik,Sunil Ojha,G.R. Umapathy,Akhilesh Pandey,Shyama Rath
DOI: https://doi.org/10.1016/j.apsusc.2024.160296
IF: 6.7
2024-05-19
Applied Surface Science
Abstract:The ion implantation-induced disorder and strain in 4H-SiC implanted with 200 keV Si ions and its subsequent recrystallization by thermal annealing are investigated. The concentration of randomly displaced atoms (RDA) are determined from Rutherford Backscattering Spectroscopy in channeling geometry. The depth profiles of the strain and the crystalline quality are assessed through the Debye-Waller factor determined from simulations of the High-Resolution X-Ray Diffraction patterns. Raman spectroscopic measurements support the ion-induced crystalline to amorphous transitions and the recrystallization upon annealing.
chemistry, physical,physics, applied, condensed matter,materials science, coatings & films
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