Study of a silicon/glass bonded structure with a UV-curable adhesive for temporary bonding applications

P. Montméat,T. Enot,M. De Marco Dutra,M. Pellat,F. Fournel
DOI: https://doi.org/10.1016/j.mee.2017.03.008
IF: 2.3
2017-04-01
Microelectronic Engineering
Abstract:This paper concerns the study of a temporary bonding process: 3MTM Wafer Support System. This process is dedicated to the handling of thin silicon wafers with a glass carrier bonded with a UV curable polymer. The dismounting process is achieved after a laser treatment. Firstly, the 300mm bonding process leads to a very homogeneous bonded structure without any bonding defects. The morphology of the bonded structure is mainly dependent of the morphology of the glass. Secondly this process is also compatible with a back – grinding process and the thinned silicon structure can be processed up to 250°C. When using a blank silicon wafer, the 3MTM dismounting process (laser and peeling) leads to a silicon thin wafer without any cracks, chippings or adhesive traces. Finally the laser process can be removed from the debonding steps and a single mechanical dismounting process can be used.
engineering, electrical & electronic,nanoscience & nanotechnology,optics,physics, applied
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