Abstract:Low dielectric polyimide microsphere/polyimide composite films composite film with good comprehensive properties was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. A low dielectric polyimide/polyimide microsphere (PI/PM) composite film was constructed by thermal imidization of polyamic acid from pyromellitic dianhydride (PMDA) and 4,4′‐oxydianiline (ODA) in the presence of porous PM. The PM particles with particle size of about 2 μm were prepared via the solvothermal method using 3,3′,4,4′‐benzophenonetetracarboxylic dianhydride (BTDA) and ODA as monomers through thermal imidization. Due to the favorable compatibility between the porous PM and PI matrix, the mechanical properties, thermal stability, and dielectric properties of the obtained composite films were significantly improved. The PI/PM composite films had a tensile strength of 44.18–64.32 MPa, and the corresponding elongation at break of 6.21%–11.7%. Furthermore, the thermogravimetric temperatures of T5% were 538.9–563.7°C. The dielectric constants of the composite films at 1 MHz were 2.59–3.68, and the corresponding dielectric loss were only 0.0119–0.00405. Thus, the combination of excellent mechanical properties, high thermal stability, extremely low dielectric constant, and dielectric loss make the composite films ideal for deployment as high‐performance materials for 5G applications. Highlights Low dielectric polyimide composite film was prepared by thermal imidization of polyamic acid in the presence of porous polyimide microspheres. Porous polyimide microspheres were prepared by thermal using the imidization solvothermal method. Low dielectric polyimide composite film with good comprehensive properties.

Preparation of low dielectric constant and low loss PI/PTFE composite films by self-assembly of microbranched structures

Polyimide Foams with Ultralow Dielectric Constants

Enhancing the dielectric and thermal properties of polytetrafluoroethylene-based composites through designing and constructing a novel interfacial structure

Poly (arylene Sulfide Sulfone)/polytetrafluoroethylene Composite Film: Thermal, Mechanical, Hydrophobic and Low Dielectric Constant Properties

Study on the adhesion of PTFE/PI composite films by interlocking synergistic effects

Fabrication and the film-forming mechanism of thin polytetrafluoroethylene films with enhanced dielectric and mechanical properties

Mechanical, dielectric and thermal properties of polyimide films with sandwich structure

Ultra-low-permittivity, high hydrophobic, and excellent thermally stable fluoroelastomer/polyimide composite films employing dielectric reduction

Fluorographene/polyimide composite films: Mechanical, electrical, hydrophobic, thermal and low dielectric properties

Flexible Polytetrafluoroethylene (PTFE) Composite Film with Enhanced Thermal Conductivity and Low Interface Thermal Resistance for High Frequency Electronics

Preparation of fluorinated polyimides with low dielectric constants and low dielectric losses by combining ester groups and triphenyl pyridine structures

Low-Temperature Synthesis of Polyimide/Poly(Vinylidene Fluoride) Composites with Excellent Dielectric Property

Flexible Low Dielectric Polyimide/Fluorinated Ethylene Propylene Composite Films for Flexible Integrated Circuits

Polyimide composites containing core shell particles with high dielectric constant and low dielectric loss

Thermal, Mechanical and Dielectric Properties of Polyimide Composite Films by In-Situ Reduction of Fluorinated Graphene

Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Preparation and Properties of Low-Dielectric Polyimide Films Containing Tert-Butyl

Preparation and properties of branch‐leaf‐like polyimide composite films with high thermal conductivity and low dielectric loss

Fluorinated polyimide with polyhedral oligomeric silsesquioxane aggregates: Toward low dielectric constant and high toughness

High-Dielectric PVP@PANI/PDMS Composites Fabricated via an Electric Field-Assisted Approach

Surface-modified Li3Mg2NbO6 ceramic particles and hexagonal boron nitride sheets filled PTFE composites with high through-plane thermal conductivity and extremely low dielectric loss