Abstract:Advanced integrated circuit materials demand polymer composites with exceptional thermal conductivity and low dielectric constant to minimize power consumption and improve signal transmission. However, conventional methods of improving the thermal conductivity of composites by incorporating thermal conductive fillers result in an increase in dielectric constant, producing a huge challenge in simultaneously achieving enhanced thermal conductivity and low dielectric constant. Herein, a brick-and-mortar structure has been successfully constructed through in-situ polymerization of the diamine-assisted mechanochemical exfoliated (DAME) boron nitride (BN) with trifluoromethyl-containing PI and microporous polyhedral oligomeric silsesquioxane (POSS) under pressure. The DAME functionalized BNNS (f-BN) exhibit high aspect ratios, few lattice defects, high yields and excellent dispersion in the POSS/PI matrix. Notably, the obtained 40 wt% f-BN/POSS/PI nanocomposite exhibits a high in-plane thermal conductivity of 17.76 W m−1 K−1 with a 488% enhancement compared to 40 wt% hBN/POSS/PI, and simultaneously maintains low dielectric constant of 2.76 and low dielectric loss of 0.0042 at 1 MHz close to the pure POSS/PI matrix. Density functional theory is utilized to reveal the possible chemical reactions between f-BN and diamine, and the impacts of interfacial functionalization on the thermal conductivity and dielectric properties of nanocomposites are illustrated by molecular dynamics simulations. Furthermore, the DAME method demonstrates good universality among polyimide matrices, and shows excellent practical implementation as a thermal interface material and flexible printed circuit board. This material provides a promising solution for integrated circuits by successfully addressing the challenge of combining low dielectric constant and high thermal conductivity in microelectronic systems.

Preparation and properties of branch‐leaf‐like polyimide composite films with high thermal conductivity and low dielectric loss

Polyhedral oligosilsesquioxane-modified boron nitride enhances the mechanical properties of polyimide nanocomposites

Enhanced in-plane thermal conductivity of polyimide-based composites via in situ interfacial modification of graphene

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

Enhanced thermal conductivity of carbon nitride-doped graphene/polyimide composite film via a “deciduous-like” strategy

Vacuum filtration-assisted design of hierarchical structure in polyimide-BN composite films: Toward enhanced thermal conductivity, low dielectric and electrical insulation

Covalent Bond-Assisted Continuous Interface Structure for High Thermal Conductive Polyimide Composite Films

Enhanced thermal conductivity in copolymerized polyimide

Greatly enhanced thermal conductivity of polyimide composites by polydopamine modification and the 2D-aligned structure

Flexible and quasi-isotropically thermoconductive polyimide films by guided assembly of boron nitride nanoplate/boron nitride flakes for microelectronic application

High Electrical and Mechanical Properties Obtained in A Polyimide Based Nanocomposite with Sandwich Structure via Multi‐Dimensional Design

Enhanced out-of-plane thermal conductivity of polyimide composite films by adding hollow cube-like boron nitride

Low dielectric polyimide microsphere/polyimide composite films based on porous polyimide microsphere

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization under pressure

Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant

Polyimide-based composites reinforced by carbon nanotube-grafted carbon fiber for improved thermal conductivity and mechanical property

Dual‐effect Coupling for Superior Dielectric and Thermal Conductivity of Polyimide Composite Films Featuring "Crystal‐like Phase" Structure

Achieving low dielectric loss and high energy density of polyimide composite dielectric film: inhibiting the formation of conductive path in both macro–microscales

Dual covalent bond induced high thermally conductive polyimide composite films based on CNT@CN complex filler

Preparation and characteristics of composite films with functionalized graphene/polyimide