Abstract:Hybrid fillers to build an efficient thermal conductivity network. Traditional integrated circuit (IC) packaging materials and printed circuit board substrate materials suffer from several limitations including low thermal conductivity, high coefficient of thermal expansion (CTE), and poor dielectric properties. Although significant efforts have been made to enhance these properties, achieving a single composite system with simultaneous high thermal conductivity, extremely low CTE, and dielectric loss remains a formidable task. In this study, we propose a hybrid polymer composite system that addresses these challenges. Our approach involves utilizing a thermosetting polyphenylene oxide (PPO) as the resin matrix, while incorporating boron nitride (BN) sheets with high thermal conductivity and alumina (Al2O3) spheres with favorable fluidity as fillers. To optimize the composite properties, the filler surfaces are modified using dopamine and silane coupling agents, ensuring proper interface control. The composites exhibit significant improvements in thermal conductivity, reduced dielectric loss and CTE, while maintaining excellent processibility. Specifically, with a composition of 25 vol% BN and 25 vol% Al2O3, the thermal conductivity of the composite reaches 2.18 W·m−1 K−1, surpassing neat PPO resin by a factor of 10.9. Simultaneously, the CTE decreases from 2.27% to 1.18% between 50 and 260°C, and the dielectric loss reduces from 0.0024 to 0.0011 at 10 GHz, as compared to neat PPO resin. Highlights The reported novel hybrid composite offers a promising solution to the limitations of traditional IC packaging materials. The reported hybrid composite exhibits significantly improved thermal conductivity, ultralow dielectric loss, and reduced coefficient of thermal expansion, while maintaining excellent processibility. The thermal conductivity of the composites reaches 2.18 W·m−1 K−1, surpassing that of the neat resin by a factor of 10.9, meanwhile the dielectric loss is as low as 0.0011 at 10 GHz, which is extremely difficult to achieve simultaneously for thermosetting polymer composites. Synergetic effects were realized with the hybridization of fillers with different dimensionality, and proper filler surface modification.

Multifunctional boron nitride nanosheets/fluorinated‐polyimide composites with ultra‐low dielectric constant and high thermal conductivity

Alkylated modified boron nitride nanosheets/polyimide composite films with advanced thermal conductivity and low dielectric constant

One-step alkyl-modification on boron nitride nanosheets for polypropylene nanocomposites with enhanced thermal conductivity and ultra-low dielectric loss

Polyimide Composites with Fluorinated Graphene and Functionalized Boron Nitride Nanosheets for Heat Dissipation

High thermal conductivity and low dielectric polyimide nanocomposites using diamine-assisted mechanochemical exfoliation boron nitride and in-situ polymerization under pressure

Enhanced Thermal Conductivities and Decreased Thermal Resistances of Functionalized Boron Nitride/polyimide Composites

Highly Thermoconductive and Mechanically Robust Boron Nitride/aramid Composite Dielectric Films from Non-Covalent Interfacial Engineering

Boron Nitride Nanosheets Endow the Traditional Dielectric Polymer Composites with Advanced Thermal Management Capability

Polyphenylene oxide/boron nitride–alumina hybrid composites with high thermal conductivity, low thermal expansion and ultralow dielectric loss

Enhanced out-of-plane thermal conductivity of polyimide composite films by adding hollow cube-like boron nitride

Synergistic Improvement in Thermal Conductivity of Polyimide Nanocomposite Films Using Boron Nitride Coated Copper Nanoparticles and Nanowires

High-concentration polybenzimidazole-assisted exfoliation of boron nitride nanoflakes for polymer composites

Polymer/boron nitride nanosheet composite with high thermal conductivity and sufficient dielectric strength

Thermal conductivity enhancement of polyimide films filled with BN and AlN fillers

Largely improved thermal conductivity of PI/BNNS nanocomposites obtained by constructing a 3D BNNS network and filling it with AgNW as the thermally conductive bridges

A Green and Facile Method to Fabricate Multifunctional and Highly Thermally Conductive Boron Nitride‐based Polymer Composites

Fluorinated boron nitride nanosheets for high thermal conductivity and low dielectric constant silicone rubber composites

Highly Thermally Conductive Dielectric Nanocomposites with Synergistic Alignments of Graphene and Boron Nitride Nanosheets

Highly anisotropic thermally conductive polyimide composites via the alignment of boron nitride platelets

Electrostatic self‐assembly of barnacle‐like modified BN@ND hetero‐structured fillers to synergistic enhanced thermal conductivity of PI composite films

A highly thermally conductive yet electrically insulating boron nitride nanosheets/polyetherimide composite with oriented structure