Optimization Method and Online Detection of SSPC Transient Temperature Rise

W. Li,Yang Dongping,He Xiong,Wu Jian-chao,Wang Jie,Chen Yonggang
DOI: https://doi.org/10.1109/SPIES55999.2022.10081993
2022-12-09
Abstract:This paper analyzes the heat dissipation mechanism of SSPC when the switch is turned on under capacitive load conditions, and gives two methods to reduce the instantaneous temperature rise suitable for engineering applications. In order to further ensure that the VDMOS junction temperature of the power device is controlled within the safe working area under capacitive load conditions, this paper proposes an on-line detection method for transient temperature rise based on the thermal-sensitive electrical parameter method, which is compared with the measured results of the infrared thermal imaging method. and the junction temperature measurement accuracy error is about less than 2%.
Engineering,Physics
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