Abstract:The heating system is an essential component of the glass molding process. It is responsible for heating the glass to an appropriate temperature, allowing it to soften and be easily molded. However, the energy consumption of the heating system becomes particularly significant in large-scale production. This study utilized G-11 glass for the simulation analysis and developed a finite element model for the thermal conduction of a 3D ultra-thin glass molding system, as well as a thermal bending model for smartwatches. Using finite element software, the heat transfer between the mold and the glass was modeled, and the temperature distribution and thermal stress under various processing conditions were predicted. The findings of the simulation, when subjected to a numerical analysis, showed that heating rate techniques significantly affect energy consumption. This study devised a total of four heating strategies. Upon comparison, optimizing with heating strategy 4, which applies an initial heating rate of 35 mJ/(mm2·s) during the initial phase (0 to 60 s) and subsequently escalates to 45 mJ/(mm2·s) during the second phase (60 to 160 s), resulted in a reduction of 4.396% in the system's thermal output and a notable decrease of 7.875% in the heating duration, respectively. Furthermore, a single-factor research method was employed to study the forming process parameters. By comparing the numerical simulation results, it was found that within the temperature range of 615–625 °C, a molding pressure of 25–35 MPa, a heating rate of 1.5–2.5 °C/s, a cooling rate of 0.5–1 °C/s, and a pulse pressure of 45–55 Hz, the influence on residual stress and shape deviation in the glass was minimal. The relative error range was within the 20% acceptable limit, according to the experimental validation, which offered crucial direction and ideas for process development.

P‐11.3: Splicing Seam Simulation Analysis of Glass‐based Micro LED Splicing Screen

The study on the splicing seam of mini‐light‐emitting‐diode display screen

Study on thermal splicing of ZBLAN fiber to silica fiber

P‐145: Distinguished Poster: The Impact of Packaging Film Structure on the Color Seam of Mini LED Display

59.2: Three Dimensional Floating Light‐Field Display Based on Spliced Multi‐LCDs

Wafer-Level Monolithic Integration of Vertical Micro-LEDs on Glass

Laser cutting sandwich structure glass–silicon–glass wafer with laser induced thermal–crack propagation

23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology

64‐2: Ultra‐Thin RGB Mini‐LED Backlight for High‐end Professional Liquid Crystal Displays

P‐6.2: A Study on Micro‐LED Selective Repair Technology for Mass Production Purpose

Optical Simulation Design of Surface Mounted Device Beads for Wide Beam and High Uniformity Display

41‐2: A Patterned Packaging Scheme of MiniLED Tiled Display with HighTransmittance and High Color Consistency in Light and Dark States

Study of the thermo-mechanical behavior of glass interposer for flip chip packaging applications

Thermal Bending Simulation and Experimental Study of 3D Ultra-Thin Glass Components for Smartwatches

Tensile strength and crack tip stress distribution of modified glass in the composite laser beam separation

Performance simulation of diffuser with microstructure for LCD backlight system

Mesoscopic numerical simulation analysis of electromagnetic transmission properties of prefabricated glass microbeads-cement paste composites

Fusion Splicing Photonic Crystal Fibers and Conventional Single-Mode Fibers: Microhole Collapse Effect

P‐11.2: Super‐thin Mini‐LED Direct Back Light for Liquid Crystal Displays

Semiconductor laser asymmetry cutting glass with laser induced thermal-crack propagation

Smart Window with Reversible and Instantaneous Photoluminescence based on Microsphere Structure