Abstract:Pixel crosstalk resulted by the inherent Lambertian radiation of LED chips significantly hiders the quality of mini/micro‐LED display devices. Fully enclosed composite micro/nano‐package structure and in situ nanoimprint technology is proposed in this paper. By composite micro/nano‐packaging, the divergence angle of the single pixel decreases to 72°, and the light‐extraction efficiency increases 18.4%. Micro/mini‐light emitting diode (LED) arrays are regarded as the most promising next generation of display devices. However, the inherent Lambertian radiation of LED chips results in a significant pixel crosstalk. To improve the display quality, high‐quality micro/mini‐LED display pixels with fully enclosed composite micro/nano‐packages and in situ nanoimprint technology are proposed and demonstrated in this work. The nanoimprint template is designed as a composite structure comprising an intermediate sandwich cavity array and thin‐bottom nanostructure layer. Contact is maintained between the template and LED chips array substrate. By vacuuming the sealed sandwich cavities, the thin‐bottom nanostructure layer is deformed to drive the upward protrusion of the liquid optical polymer. Moreover, the nanocavities on the thin nanostructure layer are fully filled by the polymer, forming a composite micro/nano‐package. The characteristics of the composite micro/nano‐package, such as the aperture and protrusion height, can be flexibly adjusted by changing the template structure or process parameters. A 6 × 8 array LED chips display device enclosed by a composite micro/nanopackage is developed. The divergence angle of the single LED chip decreases to 72° from the original 138°, the light‐extraction efficiency increases18.4%, and the luminescence spectrum and current‐voltage characteristics changes only minimally.

P‐145: Distinguished Poster: The Impact of Packaging Film Structure on the Color Seam of Mini LED Display

The study on the splicing seam of mini‐light‐emitting‐diode display screen

41‐2: A Patterned Packaging Scheme of MiniLED Tiled Display with HighTransmittance and High Color Consistency in Light and Dark States

Enhanced Packaging for Reliability Improvement of P1.2 Mini-LED Emissive Displays in High Temperature and Humidity

P‐8.4: Research on Chip Layout Design and Printing Process Optimization of Mini‐LED Light Board

Quantum Dot Film Patterning on a Trenched Glass Substrate for Defining Pixel Arrays of a Full-color Mini/Micro-LED Display

P‐11.3: Splicing Seam Simulation Analysis of Glass‐based Micro LED Splicing Screen

Uniformity improvement of a mini-LED backlight by a quantum-dot color conversion film with nonuniform thickness.

55.2: A Novel Sn Paste Free Approach for Manufacturing Mini‐LED Display

Full-color micro-LED displays with cadmium-free quantum dots patterned by photolithography technology

92‐1: Invited Paper: Wide‐Color‐Gamut and Stable MicroLED Displays Using UV‐Pumped Cd‐Free Quantum Dots

Design of Optical Structure for Chip-on-board Wafer Level Packaging LEDs

Fully Enclosed Composite Micro/Nano‐Package for High‐Quality Micro‐LED Display Pixels and In Situ Nanoimprint Technology

18.4: Full‐Color Active‐matrix Mini‐LED Display based on Novel Color Conversion Technology

Zno Quantum Dots-Filled Encapsulant for Led Packaging

Investigation of Enhanced Ambient Contrast Ratio in Novel Micro/Mini-LED Displays

P‐14.1: Improving the Performance of Inkjet Printed QLED by Annealing Post‐treatment

The scaling of the microLED and the advantage of 2D materials

Alleviating the Crosstalk Effect Via a Fine-Moulded Light-Blocking Matrix for Colour-Converted Micro-Led Display with a 122% NTSC Gamut

Development of a “Flip Glass Substrate” LED package technology for color bin yield and view angle enhancement

11.3: A Truly Borderless Design for Tiled Micro‐LED Display