Abstract:Pixel crosstalk resulted by the inherent Lambertian radiation of LED chips significantly hiders the quality of mini/micro‐LED display devices. Fully enclosed composite micro/nano‐package structure and in situ nanoimprint technology is proposed in this paper. By composite micro/nano‐packaging, the divergence angle of the single pixel decreases to 72°, and the light‐extraction efficiency increases 18.4%. Micro/mini‐light emitting diode (LED) arrays are regarded as the most promising next generation of display devices. However, the inherent Lambertian radiation of LED chips results in a significant pixel crosstalk. To improve the display quality, high‐quality micro/mini‐LED display pixels with fully enclosed composite micro/nano‐packages and in situ nanoimprint technology are proposed and demonstrated in this work. The nanoimprint template is designed as a composite structure comprising an intermediate sandwich cavity array and thin‐bottom nanostructure layer. Contact is maintained between the template and LED chips array substrate. By vacuuming the sealed sandwich cavities, the thin‐bottom nanostructure layer is deformed to drive the upward protrusion of the liquid optical polymer. Moreover, the nanocavities on the thin nanostructure layer are fully filled by the polymer, forming a composite micro/nano‐package. The characteristics of the composite micro/nano‐package, such as the aperture and protrusion height, can be flexibly adjusted by changing the template structure or process parameters. A 6 × 8 array LED chips display device enclosed by a composite micro/nanopackage is developed. The divergence angle of the single LED chip decreases to 72° from the original 138°, the light‐extraction efficiency increases18.4%, and the luminescence spectrum and current‐voltage characteristics changes only minimally.

55.2: A Novel Sn Paste Free Approach for Manufacturing Mini‐LED Display

Direct Design of Thin and High-Quality Direct-Lit LED Backlight Systems

Efficient Mini/Micro-Perovskite Light-Emitting Diodes

16‐2: A 4‐inch Full Color Active‐matrix Mini‐LED Display Based on 0408 Chip and 500um Pixel

37‐1: Invited Paper: Manufacturing Readiness of High‐Efficiency and Low‐Cost MicroLED Displays

Mass transfer for Micro-LED display: Transfer printing techniques

Research Progress of Micro-LED Display Technology

87‐5: AM Mini‐LED Based on LTPS TFT Backplane with over 5000 Dimming Zones and High Driving Bits

18.4: Full‐Color Active‐matrix Mini‐LED Display based on Novel Color Conversion Technology

24.1: Invited Paper: Micro‐LED 4.78 inch Tiled Display Modules with 100% Yield Achieved by Stamp Transfer Technology

P‐11.2: Super‐thin Mini‐LED Direct Back Light for Liquid Crystal Displays

Mini-LED Backlight: Advances and Future Perspectives

64‐2: Ultra‐Thin RGB Mini‐LED Backlight for High‐end Professional Liquid Crystal Displays

Development of Digital Signage Modules composed of Mini-LEDs using Laser-Assisted Bonding (LAB) Technology

Fully Enclosed Composite Micro/Nano‐Package for High‐Quality Micro‐LED Display Pixels and In Situ Nanoimprint Technology

23‐3: Application of Laser‐Assisted Bonding in Micro‐LED display technology

Advanced Manufacturing of Microscale Light-Emitting Diodes and Their Use in Displays and Biomedicine

Alleviating the Crosstalk Effect Via a Fine-Moulded Light-Blocking Matrix for Colour-Converted Micro-Led Display with a 122% NTSC Gamut

Prospects and challenges of mini-LED and micro-LED displays

An Active Matrix Mini‐LEDs Backlight Based on A‐si

Transfer-printed, tandem microscale light-emitting diodes for full-color displays