Abstract:Aspheric thin-walled crucibles with large diameters are widely used for photovoltaics and semiconductor industries, while they have hard-brittle and aspheric characteristics. Nevertheless, these crucibles strictly require atomic surfaces and high material removal rate (MRR). This is a challenge for chemical mechanical polishing (CMP). To break this challenge, a novel green CMP was developed for fused silica, containing ceria, lanthana, hydrogen peroxide, diethylene triaminepentaacetic acid pentasodium, carboxymethyl cellulose sodium and guanidine carbonate. After CMP, surface roughness Ra of 0.115 is obtained at a scanning area of 5 × 5 μm2 measured by atomic force microscopy, and MRR is 563 nm/min. In such an atomic surface, the MRR is the highest compared with those published previously. Transmission electron microscopy confirms that the thickness of damaged layer after CMP is only 2.63 nm. A novel approach of robot floating polishing is proposed for aspheric crucibles with a diameter of 810 mm and a height of 580 mm. Using the developed CMP, surface roughness Sa of 0.178 nm on inner surface of an aspheric thin-walled crucible is achieved under a measurement area of 50 × 50 μm2. X-ray photoelectron spectroscopy (XPS) and electron paramagnetic resonance reveal that the content of Ce3+ increased from 28.54 to 43.76 %. Through Raman, XPS and Fourier transform infrared spectroscopy, CMP mechanisms are elucidated. Densified damaged layer on the surface of fused silica was induced by the transformation of surface structure from six-membered to four- or three-membered network. Ce-OH and Si-OH were formed between fused silica and ceria abrasives, forming Ce-O-Si by condensation reaction of dehydration. The developed green CMP and approach provide new pathway to polish and manufacture atomic surfaces for aspheric thin-walled crucibles with large diameters.

Atomic surface achieved through a novel cross-scale model from macroscale to nanoscale

Molecular Modeling of the Mechanical Effect in the Chemical Mechanical Polishing Process

Surface Morphology Evolution during Chemical Mechanical Polishing Based on Microscale Material Removal Modeling for Monocrystalline Silicon

An in Situ Study of Chemical-Mechanical Polishing Behaviours on Sapphire (0001) Via Simulating the Chemical Product-Removal Process by AFM-tapping Mode in Both Liquid and Air Environments

Atomistic understanding of rough surface on the interfacial friction behavior during the chemical mechanical polishing process of diamond

Polishing Approaches at Atomic and Close-to-Atomic Scale

Atomic surface induced by novel green chemical mechanical polishing for aspheric thin-walled crucibles with large diameters

A General and Ultrafast Polishing Method with Truly Atomic Roughness

Progress in Material Removal Mechanisms of Surface Polishing with Ultra Precision

Non-continuum Material Removal Mechanism of Surface Polishing with Ultra Precision

XPS, UV–vis Spectroscopy and AFM Studies on Removal Mechanisms of Si-face SiC Wafer Chemical Mechanical Polishing (CMP)

Development of core–shell SiO 2 @A-TiO 2 abrasives and novel photocatalytic chemical machinal polishing for atomic surface of fused silica

Variation of Surface Layer During Chemical Mechanical Polish

Chemical mechanical polishing: Theory and experiment

Mechanical Model of Nanoparticles for Material Removal in Chemical Mechanical Polishing Process

Investigation of Material Removal Mechanism of Silicon Wafer in the Chemical Mechanical Polishing Process Using Molecular Dynamics Simulation Method

Mechanism and Applications of Chemical and Mechanical Polishing

Unprecedented atomic surface of silicon induced by environmentally friendly chemical mechanical polishing

A novel atomic removal model for chemical mechanical polishing using developed mesoporous shell/core abrasives based on molecular dynamics

Angstrom surface on copper induced by novel green chemical mechanical polishing using ceria and silica composite abrasives

A nano-scale mirror-like surface of Ti–6Al–4V attained by chemical mechanical polishing