Dynamic simulation of transient electric shock process in humans under high altitude UHVDC transmission lines

Aiqing Ma,Jinshuai Xu,Wei Wang,Kexin Wang
DOI: https://doi.org/10.1016/j.epsr.2024.111178
IF: 3.818
2024-10-27
Electric Power Systems Research
Abstract:Aiming at the issue that existing research methods for human transient electric shock do not take into account the altitude factor, resulting in deviations in transient electric shock calculations at high altitudes, a dynamic simulation method of the electric shock process considering actual environmental factors is proposed. The study investigates the characteristics of line-induced voltage at different altitudes. Based on this, a dynamic model of the electric shock process is established and the formula for model parameters is fitted with altitude. This allows for analysis of streamer propagation characteristics and transient electric shock current at different altitudes. The effectiveness of this method is verified by comparing it to existing experiments. Finally, an evaluation of human transient electric shock at different altitudes is conducted. Previous studies have identified metal greenhouses as the primary sites of transient electric shock phenomena under UHVDC lines, and these structures have been utilized as the focus of research. The research reveals that as altitude increases, there is an increase in relative voltage between the human body and metal greenhouse, reaching 3261.3 V at an altitude of 4000 m; however, this relative voltage growth decreases with higher altitudes. The electron ionization coefficient increases rapidly while the adhesion coefficient increases slowly with elevation. Under a constant contact gap distance, there is faster reception of electric shock by the human body with increasing altitude. Additionally, there is a larger amount of transient electric shock energy received by the human body; its maximum value being 5.358 mJ - although this is far less than the human death threshold of 25 J and will not cause death to humans.
engineering, electrical & electronic
What problem does this paper attempt to address?