Experiments of Sub-micron Superjunction Devices with Ultra-low Specific On-resistance

Wentong Zhang,Fengrun Tian,Yuting Liu,Teng Liu,Nailong He,Sen Zhang,Ming Qiao,Zhaoji Li,Bo Zhang
DOI: https://doi.org/10.1109/led.2023.3274514
IF: 4.8157
2023-01-01
IEEE Electron Device Letters
Abstract:A sub-micron superjunction (SM SJ) device with ultra-low specific on-resistance Ron,sp is proposed and experimentally realized in this letter. The new device features a surface SM SJ with a mean ion implantation depth of 190 nm and a bulk curvature effect suppressing layer (CSL) with a junction depth of 3.7 μm. The highly doped SM SJ acts as a ultra-low resistance current path to reduce the specific on-resistance Ron,sp meanwhile the CSL shields the possible curvature effect for high breakdown voltage VB. Experiments of the SM SJ device demonstrated a significantly increased total N-type doping dose up to 9.7 × 1012 cm-2 that is almost 10 times of the conventional RESURF dose. A measured low Ron,sp of 27.8 mΩ∙cm2 was observed under a VB of 622.6 V, realizing a high figure of merit FOM = VB2 / Ron,sp of 13.94 MW/cm2 and a reduction of 62.2% when compared with the theoretical limit of the triple RESURF technology under the same VB.
engineering, electrical & electronic
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