Abstract:Pairs of electrodes with nanometer separation (nano-gap) are achieved through an electromigration-induced break-junction (EIBJ) technique at room temperature. Lithographically defined gold (Au) wires are formed by e-beam evaporation over oxide coated silicon substrates silanized with (3-Mercaptopropyl)trimethoxysilane (MPTMS) and then subjected to electromigration at room temperature to create a nanometer scale gap between the two newly formed Au electrodes. The Si-O-Si covalent bond at the SiO$_2$ surface and the Au-sulphur (Au-S) bond at the top evaporated Au side, makes MPTMS as an efficient adhesive monolayer between SiO$_2$ and Au. Although the Au wires are initially 2$\mu$m wide, gaps with length $\sim$1nm and width $\sim$5nm are observed after breaking and imaging through a field effect scanning electron microscope (FESEM). This technique eliminates the presence of any residual metal interlink in the adhesion layer (chromium or titanium for Au deposition over SiO$_2$) after breaking the gold wire and it is much easier to implement than the commonly used low temperature EIBJ technique which needs to be executed at 4.2 K. Metal-molecule-metal structures with symmetrical metal-molecule contacts at both ends of the molecule, are fabricated by forming a self-assembled monolayer of -dithiol molecules between the EIBJ created Au electrodes with nanometer separation. Electrical conduction through single molecules of 1,4-Benzenedimethanethiol (XYL) is tested using the Au/XYL/Au structure with chemisorbed gold-sulfur (Au-S) coupling at both contacts.

Fabrication of Asymmetric Electrode Pairs with Nanometer Separation Made of Two Distinct Metals

Fabrication of nanometer-spaced electrodes using gold nanoparticles

Controlled Fabrication of Metallic Electrodes with Atomic Separation

Electrochemical Fabrication of Nanoporous Gold

Electric field-directed assembly of gold and platinum nanowires from an electrolysis process

Pairs of Gold Electrodes with Nanometer Separation Performed over SiO$_2$ Substrates with a Molecular Adhesion Monolayer

Self-aligned Split Gate Electrodes Fabricated on Suspended Carbon Nanotubes

Electrochemical Fabrication of Atomically Thin Metallic Wires and Electrodes Separated with Molecular-Scale Gaps

Chemical fabrication of heterometallic nanogaps for molecular transport junctions.

Fabrication of Metal Nanoelectrodes by Interfacial Reactions

Suspended Multiwalled Carbon Nanotubes As Self-Aligned Evaporation Masks.

Precise Fabrication of Uniform Molecular Gaps for Active Nanoscale Devices

Electrochemical Approach for Fabricating Nanogap Electrodes with Well Controllable Separation

Fabrication of nanogap metal electrode with sacrificial layer techniques

Fabrication of A Nano-Scale Gap by Selective Chemical Deposition

Controllably Constructing Gold Nanostructures on Electrodes Through Growth of Zinc Oxide Nanorods and Two-Step Electroplating

Metal nanoparticle wires formed by an integrated nanomolding-chemical assembly process: fabrication and properties.

Direct Electrochemical Fabrication of Metallic Nanopillar Array on Au Electrode Surface by the Template Technique

Construction of 3D Metallic Nanostructures on an Arbitrarily Shaped Substrate.

Fabricating Atom-Sized Gaps by Field-Aided Atom Migration in Nanoscale Junctions

Nanofabrication of Metal Structures in Gold-Films Deposited on Mica