Influence of interfacial configuration on bonding strength and wettability between CuNiTi active filler metal and AlN ceramic

Haifeng Xu,Fanwei Meng,Xuanwei Lei,Jian Yang,Jihua Huang,Shuhai Chen,Yue Zhao

DOI: https://doi.org/10.1016/j.ceramint.2020.07.047

IF: 5.532

2020-11-01

Ceramics International

Abstract:<p>The influence of interfacial configuration on the bonding property and wettability between CuNiTi active filler metal and AlN ceramic was investigated using first-principles calculations within the framework of density functional theory. The results indicate that different AlN ceramic crystal planes lead to various interfacial properties in the CuNiTi active filler metal/AlN ceramic system. For the AlN non-polar crystal plane, such as AlN (100) and AlN (110), the chemical reaction with the CuNiTi filler metal increases the interfacial bonding strength because the ionic bonding at the CuNi/TiN interface is greater than that at the CuNi/AlN interface. For the AlN polar crystal plane, such as AlN (111), the chemical reaction decreases the interfacial bonding strength because the ionic bonding and covalent bonding at the CuNi/TiN interface are both weaker than that at the CuNi/AlN interface. However, the interfacial bonding strength of the CuNi/TiN (111) interface is still much larger than those of the CuNi/TiN (100) and CuNi/TiN (110) interfaces, indicating CuNiTi filler metal has better interfacial bonding property with the AlN polar crystal plane. Moreover, for the AlN (100) and AlN (110) crystal planes, the chemical reaction leads to an increase in interfacial energy, indicating that non-polar crystal planes are not conducive to the wetting and spreading of CuNiTi filler metal, while for the AlN (111) crystal plane, the chemical reaction leads to a decrease in interfacial energy, indicating that CuNiTi filler metal has good wettability with the AlN polar crystal plane.</p>

materials science, ceramics