Fracture Mechanism of Sintered Silver Film Revealed by In Situ SEM Uniaxial Tensile Loading

Keisuke Wakamoto,Daisuke Yasugi,Takukazu Otsuka,Ken Nakahara,Takahiro Namazu

DOI: https://doi.org/10.1109/tcpmt.2024.3360411

2024-03-12

IEEE Transactions on Components Packaging and Manufacturing Technology

Abstract:This article investigates the mechanism of brittle-ductile deformation and fracture for sintered silver (s-Ag) film by means of in situ scanning electron microscopy (SEM) uniaxial tensile loading at room temperature (RT) and 300 °C. The s-Ag film specimen originating from nano-Ag paste, including 18-nm-diameter Ag particles, is sintered at 300 °C under 60-MPa pressure. A precrack and slope surface are fabricated in the s-Ag specimen with a focused ion beam (FIB) for conducting in situ SEM observation during applied tensile loading. A local in situ SEM observation area is set to around the specimen's precrack tip. At RT, the s-Ag specimen shows a brittle fracture, whereas at 300 °C, the s-Ag specimen shows a ductile fracture with microstructural changes involving pore growth and grain boundary degradation. However, fracture surface morphology provides the opposite impression, where the fracture surface at 300 °C looks like an intergranular fracture. Finite-element analyses (FEAs) and electron backscatter diffraction (EBSD) suggest that the stress in the plastic region can accelerate the microstructure changes. The Ag atomic gliding speed at the grain boundary determines brittle-ductile deformation and fracture characteristics in s-Ag film. The reason why fracture surface impression differs from actual deformation is discussed using detailed snapshots during the fracture of s-Ag film at 300 °C.

engineering, manufacturing, electrical & electronic,materials science, multidisciplinary