Abstract:A new area model for estimating the layout area of switch blocks is introduced in this work. The model is based on a realistic layout strategy. As a result, it not only takes into consideration the active area that is needed to construct a switch block but also the number of metal layers available and the actual dimensions of these metals. The model assigns metal layers to the routing tracks in a way that reduces the number of vias that are needed to connect different routing tracks together while maintaining the tile-based structure of FPGAs. It also takes into account the wiring area required for buffer insertion for long wire segments. The model is evaluated based on the layouts constructed in ASAP7 FinFET 7nm Predictive Design Kit. We found that the new model, while specific to the layout strategy that it employs, improves upon the traditional active-based area estimation models by considering the growth of the metal area independently from the growth of the active area. As a result, the new model is able to more accurately estimate layout area by predicting when metal area will overtake active area as the number of routing tracks is increased. This ability allows the more accurate estimation of the true layout cost of FPGA fabrics at the early floor planning and architectural exploration stage; and this increase in accuracy can encourage a wider use of custom FPGA fabrics that target specific sets of benchmarks in future SOC designs. Furthermore, our data indicate that the conclusions drawn from several significant prior architectural studies remain to be correct under FinFET geometries and wiring area considerations despite their exclusive use of active-only area models. This correctness is due to the small channel widths, around 30-60 tracks per channel, of the architectures that these studies investigate. For architectures that approach the channel width of modern commercial FPGAs with over one to two hundreds tracks per channel, our data show that wiring area models justified by detailed layout considerations are an essential addition to active area models in the correct prediction of the implementation area of FPGAs.

Evaluating the Impact of Using Multiple-Metal Layers on the Layout Area of Switch Blocks for Tile-Based FPGAs in FinFET 7nm

An Accurate Area Model for FPGA Circuits at Advanced Technologies.

Research on Area Modeling Methodology for FPGA Interconnect Circuits

Modeling, optimization and comprehensive comparative analysis of 7nm FinFET and 7nm GAAFET devices

Model Based Layout Pattern Dependent Metal Filling Algorithm for Improved Chip Surface Uniformity in the Copper Process

Weight-Based Fpga Placement Algorithm With Wire Effect Considered

Improving FPGA Design with Monolithic 3D Integration Using High Dense Inter-Stack Via.

LEAPS: Topological-Layout-Adaptable Multi-Die FPGA Placement for Super Long Line Minimization

Modular Placement For Interposer Based Multi-Fpga Systems

General Routing Architecture Modelling and Exploration for Modern FPGAs

Design Methodology for TFT-Based Pseudo-CMOS Logic Array with Multilayer Interconnection Architecture and Optimization Algorithms

A Tile-based Interconnect Model for FPGA Architecture Exploration

Design Methodology for Thin-Film Transistor Based Pseudo-CMOS Logic Array with Multi-Layer Interconnect Architecture.

A New FPGA Packing Algorithm Based on the Modeling Method for Logic Block

Architecture Model and Resource Graph Building Algorithm for Detailed FPGA Architecture Design

VTR 8: High Performance CAD and Customizable FPGA Architecture Modelling

Complete DFM Model for High-Performance Computing SoCs with Guard Ring and Dummy Fill Effect

An Automatic Transistor-Level Tool for GRM FPGA Interconnect Circuits Optimization

Power modeling and characteristics of field programmable gate arrays

Building Post-layout Performance Model of Analog/RF Circuits by Fine-tuning Technique

Layout Driven FPGA Packing Algorithm for Performance Optimization