Application of dual-layer polysilicon deposited by PECVD in n -type TOPCon solar cells

Dong Ding,Daxue Du,Cheng Quan,Jie Bao,Sheng Ma,Huanpei Huang,Lin Li,Zhengping Li,Ronglin Liu,Zheren Du,Wenzhong Shen
DOI: https://doi.org/10.1016/j.solmat.2023.112519
IF: 6.9
2023-08-24
Solar Energy Materials and Solar Cells
Abstract:Plasma-enhanced chemical vapor deposition (PECVD) has attracted much attention in the current mass-production of n -type tunnel oxide passivated contact (TOPCon) crystalline silicon (c-Si) solar cells because of the advantages of fast film forming rate and compatibility with in-situ doping. However, the PECVD technology is limited by the effect of ion bombardment on the ultra-thin SiO 2 layer during gas ionization, together with the inevitable front wrap-around poly-Si. Here, the dual-layer poly-Si stack made up of the intrinsic poly-Si( i ) and in-situ P -doped poly-Si( n + ) has been achieved by adjusting the deposition power, pulse voltage duty cycle, and flow rate of the PH 3 , which effectively protects the tunneling SiO 2 layer through the weakened ion bombardment to improve the interface passivation and contact resistivity. We have demonstrated that the pinhole density is an important reason for the thinner SiO 2 layer optimized less than 1.0 nm. More importantly, the conversion efficiency of n -type TOPCon c-Si solar cells can be improved by more than 0.10% and 0.15%, respectively, by the combination of the dual-layer poly-Si stack and wrap-around poly-Si removal compared with the single-layer poly-Si counterpart with the same thickness.
materials science, multidisciplinary,physics, applied,energy & fuels
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