Abstract:The inhomogeneous distributions of basal plane dislocations (BPDs) in PVT-grown 4H-SiC crystal boule due to internal stresses cause lattice plane bending, which strongly affect SiC-based device fabrication. The relationship between BPDs and local basal plane bending in 6-inch 4H-SiC substrates has been investigated. Synchrotron monochromatic beam x-ray topography (SMBXT) imaging shows black and white contrast of BPDs with Burgers vectors of opposite signs based on the principle of ray tracing. We have evaluated the net difference of BPDs with black and white contrast along both [112¯\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$$ \bar{2}$$\end{document}0] and [11¯\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$$ \bar{1}$$\end{document}00] radial directions on the Si face across multiple 6-inch diameter 4H-SiC substrates sliced from the same and different boules and predicted the nature (concave/convex) and amount of bending of the basal plane in these wafers. Line scans of 0008 reflection using high resolution x-ray diffractometry (HRXRD) has been carried out along the two directions to verify the nature of bending in these wafers. Results show quite different bending behavior along [112¯\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$$ \bar{2} $$\end{document}0] and [11¯\documentclass[12pt]{minimal}\usepackage{amsmath}\usepackage{wasysym}\usepackage{amsfonts}\usepackage{amssymb}\usepackage{amsbsy}\usepackage{mathrsfs}\usepackage{upgreek}\setlength{\oddsidemargin}{-69pt}\begin{document}$$ \bar{1}$$\end{document}00] directions, indicating that the Si face of 6-inch substrates creates non-isotropic bending on the basal plane. These observations are correlated quite well with net BPD density analysis. The physical shapes of the wafers were also measured to be not flat due to the surface effect. Quantitative analysis of the degree of basal plane bending based on the SMBXT data was carried out and found to be correlating well with the measured tilt angle from HRXRD. Existence of a high stress center was observed in one of the 6-inch wafers resulting in severe bending which is associated with both large bending angles and abrupt changes in lattice constants a and c.

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