Abstract:The self‐assembly of cracks in dried colloidal films is an intriguing phenomenon that can represent a cost‐effective and scalable alternative to conventional lithography. This study aims at overcoming technological challenges such as robustness, upscaling, and device integration, to harness self‐assembly of cracks as a low‐cost, scalable microfabrication tool for the production of large‐scale devices. When drying a colloidal solution, cracks appear in the resulting colloidal film. In certain cases, spontaneous order is observed, and cracks form arrays of periodic patterns. Although this phenomenon might be envisioned as a patterning method, overcoming practical challenges is necessary to transform it into a technological tool for microfabrication. This study explores various technological aspects aimed at leveraging the self‐assembly of cracks as a scalable microfabrication tool for large‐scale device production. Through a series of analyses, including time‐resolved Grazing‐Incidence Small‐Angle X‐Ray Scattering (GISAXS), it is offered novel insights into controlling the crack self‐ordering mechanism, minimizing defects, and implementing strategies for large‐scale patterning and pattern transfer. The process proves to be surprisingly robust, maintaining its efficacy with the same colloidal solution even after two years. By introducing biphasic dip‐coating, large‐scale crack patterns up to 100 cm2, while preserving their periodicity and ordering is achieved. As a proof of concept, the use of crack‐patterned colloidal films as masks for fabricating metallic sub‐micrometer objects, that serve as transparent electrodes with adjustable transparency and conductivity is showcased. Overall, this method presents significant advantages over conventional lithography, being cost‐effective, versatile, environmentally friendly, and scalable, thereby offering new perspectives for diverse applications requiring cost‐effective and large‐scale patterning.

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