Rational Design of Different Ga Content Bilayer InGaZnO Thin-Film Transistors With Al2O3/HfO2 Passivation Layer

Patigul Nurmamat,Ablat Abliz
DOI: https://doi.org/10.1109/ted.2024.3383429
IF: 3.1
2024-04-27
IEEE Transactions on Electron Devices
Abstract:This study investigated the effects of different Ga contents on the performance of single amorphous InGaZnO (a-IGZO) and bilayer InGa(0.5%)ZnO/InGa(1%)ZnO thin-film transistors (TFTs). Through rational design, a bilayer TFT exhibiting the best performance, including a of 1.2 V, of , SS of 0.28 V/decade, and of 32.5 cm2/Vs, was obtained. This improved performance was attributed to the InGa(0.5%)ZnO front layer enhancing the with low surface defect and high and the InGa(1%)ZnO back layer controlling the with low and in the bilayer device. Owing to the formation of energy band bending, the electrons transferred from the InGa(0.5%)ZnO to InGa(1%)ZnO layer. This resulted in the accumulation of free electrons near the interface, thereby enhancing the of the bilayer device. Moreover, a minor shift in the (0.4 and −0.5 V) of InGa(0.5%)ZnO/InGa(1%)ZnO TFTs with HfO2/Al2O3 dual passivation layer (PVL) was observed under positive and negative gate bias light illumination stress with relative humidity 60% condition. This was attributed to the HfO2/Al2O3 PVL protecting the channel from oxygen adsorption/desorption and environmental influences. Thus, the designed bilayer InGa(0.5%)ZnO/InGa(1%)ZnO TFTs with HfO2/Al2O3 PVL have enabled new pathways for achieving high-performance and highly stable oxide TFTs.
engineering, electrical & electronic,physics, applied
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