Reach on the preparation process of diamond/SiC composites with bimodal diamond particle

Zijian Zhang,Xinbo He,Tao Zhang,Pengfei Liu,Hongda Guan,Xulei Wang,Xuanhui Qu
DOI: https://doi.org/10.1016/j.coco.2023.101569
IF: 8
2023-04-01
Composites Communications
Abstract:Through a novel preparation process, 50 μm diamond particles are successfully filled into the gaps formed by closely arranged 400 μm diamond particles, thereby obtaining diamond/SiC composites with high diamond content and uniform structure. The diamond volume fraction and thermal conductivity of the composite are 79.18% and 722.55 W/mK, respectively, both are the maximum values of the diamond/SiC composites prepared by pressureless infiltration at present. The innovative preparation method provides a new solution for the uniform mixing of particles of different sizes in composites.
materials science, composites
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