Abstract:A series of thermosetting siloxane-containing polyimide resins were synthesized by incorporating of bis(p-aminophenoxy)dimethylsilane or bis(p-aminophenoxy)tetramethyldisiloxane with various concentrations into formulated oligoimides. These thermosetting polyimide resins exhibited good combination of processability and thermal resistance. It was found that siloxane-containing oligoimides provided significant advantages over unmodified oligoimides, relative to melt fluidity and processing window, due to the flexibility of D[(CH3)2SiO2/2] siloxy units. The siloxane-containing polyimide resins cured at 380 °C revealed relatively higher glass transition temperatures (Tg) than that of unmodified polyimides, despite the incorporation of flexible siloxane segment in oligoimides. Dynamic mechanical analysis and microstructure investigation suggested that some D[(CH3)2SiO2/2] siloxy units in the surface layer of polyimide transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units in the curing procedure besides crosslinking of phenylethynyl groups, due to oxidation crosslinking of siloxane. That led to inorganic silica-like structures formed in situ, and inter-connected by organic polyimide segments. This organic/inorganic hybrid characteristics endowed polyimide resins with enhanced thermal property. After post-curing at 450 °C, D[(CH3)2SiO2/2] siloxy units completely transformed into T[CH3SiO3/2] and Q[SiO4/2] siloxy units, and the polyimide reins gave the Tg even exceeding 550 °C. Meanwhile, the corresponding T700 carbon fiber reinforced composite presented excellent mechanical property and durability at the temperature as high as 500 °C.

Factors controlling the performance of film patterns of cured sol-gel-derived positive-type photosensitive oligomeric silsesquioxanes with random structure

Structural Evolution of Silica Gel and Silsesquioxane Using Thermal Curing.

Room temperature nanoimprint aided by electron beam irradiation for polysilsesquioxane

Mechanical properties and thermal stability of ambient-cured thick polysiloxane coatings prepared by a sol-gel process of organoalkoxysilanes

Effects of Coating Methods on Microstructure and Optical Properties of Mesoporous Silica Films

Preparation of Methyltrimethoxysilane Derived Silica Aerogel Films via Ambient Pressure Drying

Preparation of phenylsilsesquioxane thick films using thermal softening behavior

Correlation of SiO X Layer Thickness and Properties of BOPP/SiO X Composite Films with Spin Coating Process Parameters

Preparation of molecularly well-defined silicone resins based on trifluoropropyl-substituted trisilanol and their thermal, mechanical, and UV-resistance properties

Pore Structure Control of Macroporous Methylsilsesquioxane Monoliths Prepared by in Situ Two-Step Processing

Siloxane Oligomer with Random Structure for Use in Photosensitive White Decorative Coatings

Preparation and Thermal Stability of Polyorganosiloxane Superhydrophobic Film by Sol-Gel Method

Effect of organic hydrophobic groups on the pore structure and thermal properties of waterglass-based silica xerogels

Ultra Low Dielectric Constant Polysilsesquioxane Films Using T8(Me4NO)8 As Porogen

Interaction and Microstructure of Polyurethane/Silica Hybrid Films Prepared by Sol-Gel Process

Influence of Chemical Structures on E-Beam Lithography Performance of Polysilsesquioxanes

Cubic silsesquioxanes as a green, high-performance mold material for nanoimprint lithography.

Thiol‐ene polymerization of double‐decker‐shaped phenyl‐substituted silsesquioxanes and thiol monomers

The surface-segregated nanostructure of fluorinated copolymer-poly(dimethylsiloxane) blend films

Toward Structural Regulation and Characterization of MQ Silicone Resins

Melt fluidity and thermal property of thermosetting siloxane-containing polyimide resins and their organic/inorganic hybrid characteristics