MTT-S Technical Committee 9 Microwave and Millimeter-Wave Solid- State Devices Committee 2022–2023 Report

Guillaume Callet,Keisuke Shinohara

DOI: https://doi.org/10.1109/mmm.2024.3429088

IF: 3.0619

2024-09-21

IEEE Microwave Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

telecommunications,engineering, electrical & electronic

What problem does this paper attempt to address?

TC-11 Microwave Low-Noise Techniques Committee Report [MTT-S Society News]

Vadim Issakov,Shirin Montazeri,Joseph C. Bardin

DOI: https://doi.org/10.1109/mmm.2024.3351972

IF: 3.0619

2024-04-01

IEEE Microwave Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

telecommunications,engineering, electrical & electronic
Development of the Millimeter Wave Diagnostics on HL-2A

X. T. Ding,Z. T. Liu,Z. B. Shi,W. W. Xiao,Y. L. Li,Q. W. Yang

DOI: https://doi.org/10.1109/icimw.2006.368710

2006-01-01

Abstract:Millimeter-wave technology is widely used in the controlled fusion experiments. In this paper the new diagnostic systems on the HL-2A tokamak, including microwave reflectometry, electron cyclotron emission, was presented. The new methods for plasma particle transport and the experiments on HL-2 A tokamak was shown. The plans of the diagnostic development in next step are also presented.
The Inaugural IEEE Microwave Theory and Technology Society Inter-Society Technology Panels at the 2023 Asia Pacific Microwave Conference

J.-C. Chiao,Chow-Yen Desmond Sim,Ke Wu

DOI: https://doi.org/10.1109/mmm.2024.3363974

IF: 3.0619

2024-04-24

IEEE Microwave Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

telecommunications,engineering, electrical & electronic
Millimeter wave and sub-millimeter wave circuits for integrated system-on-a-chip

Gu, Q.J.,Xu, Z.,Chang, M.-C.F.

DOI: https://doi.org/10.1109/RFIT.2011.6141774

2011-01-01

Abstract:Deep-scaled CMOS technologies have provided ultra-high speed devices for implementing integrated millimeter wave and sub-millimeter wave system-on-a-chip (SoC). Achieving SoC necessitates key mm-wave/sub-mm-wave circuits, including signal generators and amplifiers. The paper will exemplify some of the key circuits in CMOS technologies, including a terahertz oscillator, a 450 GHz voltage controlled oscillator (VCO), a 200 GHz frequency divider, and a 200 GHz amplifier. With the availability of key building blocks, mm-wave/sub-mm-wave SoC will be realized in the near future.
2024 Spring/Summer ARFTG Microwave Measurement Conference

Dominique Schreurs,Marco Spirito,Mauro Marchetti,Dennis Lewis

DOI: https://doi.org/10.1109/mmm.2024.3364569

IF: 3.0619

2024-04-24

IEEE Microwave Magazine

Abstract:Provides society information that may include news, reviews or technical notes that should be of interest to practitioners and researchers.

telecommunications,engineering, electrical & electronic
This issue includes the journal within a journal on microwave systems and applications

Jianguo Ma

DOI: https://doi.org/10.1109/TMTT.2019.2962661

IF: 4.3

2020-01-01

IEEE Transactions on Microwave Theory and Techniques

Abstract:The IEEE Transactions on Microwave Theory and Techniques (TMTT) is the premier journal for the dissemination of scientific results regarding the design and application of high-frequency devices, circuits, and systems. Covering all theoretical and practical aspects of radio frequency technology for the last 66 years, it is regarded by the researchers and engineers as the most convenient vehicle to publish work worth sharing or to find a concept, tutorial, or technique worth knowing.
The Cross-Disciplinary MTT-S Inter-Society Technology Panels at European Microwave Week 2023

J.-C. Chiao,Ke Wu

DOI: https://doi.org/10.1109/mmm.2023.3332287

IF: 3.0619

2024-02-02

IEEE Microwave Magazine

Abstract:The Inter-Society Technology Panel (ISTP) program was established in 2021 by the IEEE Microwave Theory and Technology Society (MTT-S) as a new initiative under the auspices of the MTT-S Inter-Society Committee. This program, currently led by Drs. Ke Wu and J.-C. Chiao, collaborated with the 2023 European Microwave Week (EuMW) Steering Committee and ISTP organizers to develop two exciting panels for EuMW 2023 in Berlin, Germany. The ISTP program's goal is to provide an international platform for collaboration and exchanges of ideas among members of MTT-S, other IEEE entities (societies and councils), and non-IEEE organizations. These panels aim to facilitate discussions on cross-disciplinary research and development, involving academia, industry, standards, and commercial sectors in the context of emerging technologies and applications.

telecommunications,engineering, electrical & electronic
IEEE Microwave Theory and Technology Society Membership and Geographic Activities: Women in Microwaves Subcommittee

Amelie Hagelauer,Jasmin Grosinger,Wenquan Che,Sherry Hess

DOI: https://doi.org/10.1109/mmm.2024.3363689

IF: 3.0619

2024-04-24

IEEE Microwave Magazine

Abstract:In this column, we would like to provide you with a recent update on the activities of the Women in Microwaves (WIM) subcommittee within the IEEE Microwave Theory and Technology Society (MTT-S) Membership and Geographic Activities. WIM is dedicated to establishing an inclusive network of women in the field of microwaves that attracts, scales, and connects. We do that by promoting women engineers/scientists in the microwave community, attracting women graduate students and professionals to join MTT-S, and increasing the visibility of women within MTT-S.

telecommunications,engineering, electrical & electronic
From Microwave Acoustic Filters to Millimeter-Wave Operation and New Applications

Amelie Hagelauer,Rich Ruby,Shogo Inoue,Victor Plessky,Ken-Ya Hashimoto,Ryo Nakagawa,Jordi Verdu,Pedro de Paco,Amir Mortazawi,Gianluca Piazza,Zachary Schaffer,Ernest Ting-Ta Yen,Thomas Forster,Andreas Tag

DOI: https://doi.org/10.1109/JMW.2022.3226415

2023-01-01

IEEE Journal of Microwaves

Abstract:This paper reviews the latest developments in microwave acoustic wave devices. After an introduction and brief history of bulk acoustic wave (BAW) and surface acoustic wave (SAW) devices, a review is given for guided SAWs and XBARs - two new technologies, which are promising for future 5G applications. Following this, we discuss recent simulation techniques, such as 3D finite element method (3D FEM) and simulation of nonlinearities, as well as filter synthesis. Next, a review on tunable and reconfigurable acoustics is given. Finally, we present the latest developments in microwave acoustics for millimeter-wave (mm-wave) operation as well as BAW oscillators.
Ieee Comsoc Mmtc E-letter Multimedia Communications Technical Committee Ieee Communications Society E-letter Message from Mmtc Chair

Yonghong Tian,Tiejun Huang,Ryo Mukai,Takayuki Kurozumi,T. Kawanishi,H. Nagano,Xavier Anguera,Tomasz Adamek

2012-01-01

Abstract:Dear MMTC fellow members, Welcome to the September issue of IEEE MMTC E-letter! Time really flies. This is the first time I write to you as the vice-chair of MMTC. First of all, I want to express my sincere gratitude to the E-letter and R-letter editorial teams as well as chairs and vice–chairs of special interest groups (IG), and all contributors over the past two years. Their contribution and dedication have made both E-letter and R-letter valuable platforms for researchers in the multimedia communications society to share and exchange ideas. Special thanks also go to the former and current MMTC chairs, Dr. Haohong Wang and Dr. Jianwei Huang for their great leadership and strong support to E-letter and R-letter. Thank you! Looking forward, E-letter and R-letter editorial teams will continue to work with special issue groups of MMTC to bring to MMTC members the latest technological developments, hot research topics, and society news in multimedia communications and signal processing. Please follow closely our E-letter and R-letter. It is with my great pleasure to announce the new E-letter leadership team for the term of 2012-2014: Dr. Mao has served as MMTC IG Chair during the past two years. Starting from July 2012, E-letter will resume to be a bimonthly publication. Each issue of E-letter will feature a special issue on emerging topics that contributed by an IG and E-letter jointly and an industry column organized by an E-letter editor or guest editor. The special issue on emerging topics may consist of two types of papers, i.e., extended abstract from open call for papers or short invited papers from well-known researchers summarizing their recent works, possibly a paper published in premier IEEE publications. The full version of an accepted abstract will be recommended to fast-track review of an IEEE special issue organized by the IG. The industry column will focus on practical industry problems and solutions. Historically, many excellent E-letter contributions are position papers partially based on existing publications in top IEEE ComSoc conferences and journals. In the future, the E-letter board will make selected recommendations of these related existing publications to the R-letter board, further increasing the visibility of the E-letter contributors. Both Dr. Cheng and Dr. Wang have served as MMTC IG Chairs during the past two years. In the next two years, the new R-letter editorial board will continue to stimulate multimedia research by selecting high-quality papers on emerging …
2007 IEEE MTT-S International Microwave Symposium Digest

F. Hsiao,S. Tam,H. Yu,H. Hsieh,C. Jou,Y. Kim,Alden Wong,Alex Wong,Y. Wu,M. F. Chang

DOI: https://doi.org/10.1109/mwsym.2005.1517209

2007-01-01

Abstract:This paper list the company that participated in 2007 IEEE MTT-5 IMS Exhibition Guide.
IEEE Transactions on Microwave Theory and Techniques Special Issue: AI and Machine Learning Based Technologies for Microwaves

DOI: https://doi.org/10.1109/tmtt.2021.3090872

IF: 4.3

2021-07-01

IEEE Transactions on Microwave Theory and Techniques

Abstract:Describes the above-named upcoming special issue or section. May include topics to be covered or calls for papers.

engineering, electrical & electronic
Nanomaterial in Microwave and Millimeterwave Engineering Research in China

Erping Li,Yili Xu,Wei Hong

DOI: https://doi.org/10.1109/eumc.2014.6986598

2014-01-01

Abstract:Recently, nanomaterial is a topic of very attractive research fields from science to potential applications in microwave components and circuits. This paper briefly overviews the graphene and some other nanomaterials research and development (R&D) of institutions in China. For microwave applications, we show interconnect, transistors and some other applications.
Review of recent progress on solid‐state millimeter‐wave and terahertz signal sources

Yiqian Shan,Yuan Liang,Chenyang Li,Weifeng Sun,Zhongyuan Fang

DOI: https://doi.org/10.1002/cta.3726

IF: 2.378

2023-07-29

International Journal of Circuit Theory and Applications

Abstract:This manuscript focuses on providing a general overview of recent progress on solid‐state signal source operating beyond 60 GHz till the THz region, from the perspective of operating principle, design metrics, state‐of‐the‐art performance, testing results, and their applications in emerging mmW/THz systems. With the use of fully integrated source generators, several design arts are highlighted to showcase the recent advances of ICs toward millimeter‐wave and THz radiation, imaging, coupled oscillator network (CON), and communication. Potential future research directions enabled by mmW/THz signal sources will be envisioned. Summary The research and development on solid‐state source generators have been making progress on chip, aiming to generate low noise, high output power, and high DC‐to‐RF energy efficiency in the millimeter‐wave (mmW) and terahertz (THz) domains. In particular, their full integration in silicon technologies, such as advanced complementary‐metal‐oxide‐semiconductor processes, has motivated the design of low cost, high performance, and miniature integrated circuits (ICs). This manuscript focuses on providing a general overview of recent progress on solid‐state signal source operating beyond 60 GHz till the THz region, from the perspective of operating principle, design metrics, state‐of‐the‐art performance, testing results, and their applications in emerging mmW/THz systems. Finally, with the use of fully integrated source generators, several design arts are highlighted to showcase the recent advances of ICs toward millimeter‐wave and THz radiation, imaging, coupled oscillator network (CON), and communication. Potential future research directions enabled by mmW/THz signal sources will be envisioned.

engineering, electrical & electronic
16.6: New features and recent developments of Microwave Tube Simulator Suite

Bin Li,YiXue Wei,Zhonghai Yang,Jianqing Li,Tao Huang,Xiaolin Jin,Quan Hu,YuLu Hu,Li Xu,Xiaofang Zhu,JunJian Ma,WeiFeng Peng,Li Xiao,GuoXian He

DOI: https://doi.org/10.1109/IVELEC.2010.5503434

2010-01-01

Abstract:Microwave Tube Simulator Suite (MTSS) is a full-featured software package for microwave tube analysis and design. Recent developments to the MTSS in last year will be presented.
Microwave Devices - Carbon Nanotubes As Cold Cathodes

Kenneth B K Teo,Eric Minoux,Ludovic Hudanski,Franck Peauger,Jean-Philippe Schnell,Laurent Gangloff,Pierre Legagneux,Dominique Dieumegard,Gehan A J Amaratunga,William I Milne

DOI: https://doi.org/10.1038/437968a

IF: 64.8

2005-01-01

Nature

Abstract:To communicate, spacecraft and satellites rely on microwave devices, which at present are based on relatively inefficient thermionic electron sources that require heating and cannot be switched on instantaneously. Here we describe a microwave diode that uses a cold-cathode electron source consisting of carbon nanotubes and that operates at high frequency and at high current densities. Because it weighs little, responds instantaneously and has no need of heating, this miniaturized electron source should prove valuable for microwave devices used in telecommunications.
Guest Editorial Mini-Special Issue on the 2023 International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits

José Carlos Pedro

DOI: https://doi.org/10.1109/tmtt.2024.3461167

IF: 4.3

2024-10-11

IEEE Transactions on Microwave Theory and Techniques

Abstract:This Mini-Special Issue of the IEEE Transactions on Microwave Theory and Techniques (TMTT) contains four expanded papers from the 2023 International Workshop on Integrated Nonlinear Microwave and Millimetre- Wave Circuits (INMMiC), which was held in Aveiro, Portugal, from November 8 to 10, 2023. The INMMiC is a forum for promoting, discussing, and spreading ideas in the field of nonlinear microwave and millimeter-wave circuits and systems. The INMMiC Workshop was originally launched in Duisburg, Germany, in 1990, and achieved its present form in Rome, Italy, in 2004, after a dormant period of several years. Subsequently, the INMMiC was held at different venues around Europe, namely: in 2006 in Aveiro, Portugal; 2008 in Málaga, Spain; 2010 in Gothenburg, Sweden; 2011 in Vienna, Austria; 2012 in Dublin, Ireland; 2014 in Leuven, Belgium; 2015 in Taormina, Italy; 2017 in Graz, Austria; 2018 in Brive-La-Gaillarde, France; and in 2022 in Cardiff, the U.K.

engineering, electrical & electronic
2016 Ieee Mtt-S International Microwave Workshop Series On Advanced Materials And Processes For Rf And Thz Applications

Yong Fan,Yu Jian Cheng,Zi Xuan Huang

DOI: https://doi.org/10.1109/MMM.2016.2635935

IF: 3.0619

2017-01-01

IEEE Microwave Magazine

Abstract:Presents information on the 2016 IEEE MTT-S International Microwave Workshop Series on Advanced Materials and Processes for RF and THz Applications.
Microwave Communication under Weak Intensity to Quantumized Level: Recent Progress and Future Challenges

Chen Gong,Shanchi Wu,Chengjie Zuo,Kai Yang,Shangbin Li,Junyu Zhang,Zhongbin Dai,Ming Huang,Ming Zhao,Rui Ni,Zhengyuan Xu,Jinkang Zhu

DOI: https://doi.org/10.23919/jcin.2021.9387702

2021-01-01

Journal of Communications and Information Networks

Abstract:We provide an overview of the recent progresses on the system architecture design and performance prediction for microwave signal detection under weak signal intensity regime, up to quantumized level. The technique roadmap includes two perspectives, the opto-electro-mechanical (OEM) and superconducting devices. For the former one, we first overview the concept of OEM, and then introduce the signal detection based on capacitive-opto-electro-mechanical systems and piezo- opto-electro-mechanical systems. For the latter one, we first overview the concept and architecture of Josephson junction, and then introduce the signal detection based on superconducting Hanbury Brown-Twiss (HBT) experiments and Λ energy-level splitting system. Besides, we review the microwave detection based on Rydberg atom system. We believe that this overview can provide a guidance for future transmission limit, signal processing, detection device fabrication and real experiments.
Unleashing Next-Gen Innovations: Phase-Change Materials for RF and Acoustic Devices [From the Guest Editors’ Desk]

Tejinder Singh,Pierre Blondy

DOI: https://doi.org/10.1109/mmm.2023.3332279

IF: 3.0619

2024-02-01

IEEE Microwave Magazine

Abstract:In this curated RF focus issue of IEEE Microwave Magazine, we embark on an explorative journey into the dynamic and burgeoning world of phase-change material (PCM)-based RF and acoustic devices. These innovative materials have exhibited unprecedented potential in enhancing the performance, versatility, and functionality of a myriad of devices, paving the way for groundbreaking advancements in RF/microwave applications. Under the esteemed guidance and support of the IEEE Microwave Theory and Technology Society (MTT-S) Technical Committee-6 (TC-6), it is our pleasure to present to you a comprehensive collection of articles, each serving as a beacon of knowledge, highlighting the state-of-the-art developments and vast potential encapsulated within PCM-based technologies.

telecommunications,engineering, electrical & electronic

MTT-S Technical Committee 9 Microwave and Millimeter-Wave Solid- State Devices Committee 2022–2023 Report

TC-11 Microwave Low-Noise Techniques Committee Report [MTT-S Society News]

Development of the Millimeter Wave Diagnostics on HL-2A

The Inaugural IEEE Microwave Theory and Technology Society Inter-Society Technology Panels at the 2023 Asia Pacific Microwave Conference

Millimeter wave and sub-millimeter wave circuits for integrated system-on-a-chip

2024 Spring/Summer ARFTG Microwave Measurement Conference

This issue includes the journal within a journal on microwave systems and applications

The Cross-Disciplinary MTT-S Inter-Society Technology Panels at European Microwave Week 2023

IEEE Microwave Theory and Technology Society Membership and Geographic Activities: Women in Microwaves Subcommittee

From Microwave Acoustic Filters to Millimeter-Wave Operation and New Applications

Ieee Comsoc Mmtc E-letter Multimedia Communications Technical Committee Ieee Communications Society E-letter Message from Mmtc Chair

2007 IEEE MTT-S International Microwave Symposium Digest

IEEE Transactions on Microwave Theory and Techniques Special Issue: AI and Machine Learning Based Technologies for Microwaves

Nanomaterial in Microwave and Millimeterwave Engineering Research in China

Review of recent progress on solid‐state millimeter‐wave and terahertz signal sources

16.6: New features and recent developments of Microwave Tube Simulator Suite

Microwave Devices - Carbon Nanotubes As Cold Cathodes

Guest Editorial Mini-Special Issue on the 2023 International Workshop on Integrated Nonlinear Microwave and Millimetre-Wave Circuits

2016 Ieee Mtt-S International Microwave Workshop Series On Advanced Materials And Processes For Rf And Thz Applications

Microwave Communication under Weak Intensity to Quantumized Level: Recent Progress and Future Challenges

Unleashing Next-Gen Innovations: Phase-Change Materials for RF and Acoustic Devices [From the Guest Editors’ Desk]