The Cross-Disciplinary MTT-S Inter-Society Technology Panels at European Microwave Week 2023

J.-C. Chiao,Ke Wu
DOI: https://doi.org/10.1109/mmm.2023.3332287
IF: 3.0619
2024-02-02
IEEE Microwave Magazine
Abstract:The Inter-Society Technology Panel (ISTP) program was established in 2021 by the IEEE Microwave Theory and Technology Society (MTT-S) as a new initiative under the auspices of the MTT-S Inter-Society Committee. This program, currently led by Drs. Ke Wu and J.-C. Chiao, collaborated with the 2023 European Microwave Week (EuMW) Steering Committee and ISTP organizers to develop two exciting panels for EuMW 2023 in Berlin, Germany. The ISTP program's goal is to provide an international platform for collaboration and exchanges of ideas among members of MTT-S, other IEEE entities (societies and councils), and non-IEEE organizations. These panels aim to facilitate discussions on cross-disciplinary research and development, involving academia, industry, standards, and commercial sectors in the context of emerging technologies and applications.
telecommunications,engineering, electrical & electronic
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