Abstract:The Cu2Se compound possesses extraordinary thermoelectric performance at high temperatures and shows great potential for the application of waste heat recycling. However, a thermoelectric device usually undergoes mechanical vibration, mechanical and/or thermal cycling, and thermal shock in service. Therefore, mechanical properties are of equal importance as thermoelectric performance. However, the mechanical performance and stability of the Cu2Se compound during long-term service at high temperatures have rarely been reported. In this study, we systematically investigated the mechanical properties of Cu2Se compounds synthesized by three varied methods (melting (M), self-propagating high-temperature synthesis (SHS), and a combination of SHS and ultrasonic treatment (UT)) and investigated the thermal stability of the SHS-UT compound under different annealing temperatures. The SHS-UT process effectively refines the grain size from 19 μm for the melting sample to 5 μm for the SHS-UT sample. The high density of grain boundaries in the SHS-UT sample effectively dissipates the energy of crack propagation; thus, the mechanical properties are greatly improved. The compressive strength, bending strength, and Vickers hardness of the SHS-UT sample are 147 MPa, 52.6 MPa, and 0.46 GPa, respectively, which are 21.5, 16.6, and 35.3% higher than those of the melting sample, respectively. Moreover, excellent thermal stability is achieved in the compound prepared by SHS and ultrasonication at a temperature below 873 K. After annealing at temperatures up to 873 K for 7 days, the excellent thermoelectric performance of the Cu2Se compound is well maintained with a ZT value exceeding 1.80 at 873 K. However, with further increasing the annealing temperature to 973 K, the volatilization of Se and the precipitation of Cu result in the instability and significantly deteriorated thermoelectric performance of the material. This work provides an avenue for boosting the mechanical properties and commercial application of Cu2Se.The Supporting Information is available free of charge at https://pubs.acs.org/doi/10.1021/acsami.1c12533.Experimental section (synthesis process, characterization of structure and composition, and measurement of mechanical properties and thermoelectric transport properties); compressive strength–displacement curves, flexural strength–displacement curves, and fracture strength–displacement curves for all samples; FESEM images of fracture structures for all samples; cycling tests for SHS-UT Cu2Se bulk; X-ray diffraction patterns of the SHS-UT Cu2Se sample before and after the annealing process; and density, relative density, and averaged atomic ratio for SHS-UT Cu2Se bulks before and after the annealing process (PDF)This article has not yet been cited by other publications.

Thermal stability of thermoelectric materials via in situ resistivity measurements

A Setup for Measuring the Seebeck Coefficient and the Electrical Resistivity of Bulk Thermoelectric Materials

Thermal Stability and Oxidation Resistance of BiCuSeO Based Thermoelectric Ceramics

Thermal Stability of Thick Films Based on Low-Temperature Thermoelectric Materials of Bi-Te-Se and Bi-Te-Sb Systems Modified with Copper-Oxide Additives

High-Temperature Measurement of Seebeck Coefficient and Electrical Conductivity

Electrical and Thermal Transport Properties of Layered Bi 2 YO 4 Cu 2 Se 2

Thermoelectric properties and thermal stability of Cd-doped Cu 2 Se thermoelectric materials

Enhanced Stability and Thermoelectric Performance in Cu 1.85 Se-Based Compounds

Interfacial Stability in Bi2Te3 Thermoelectric Joints

Enhancement of thermoelectric properties over a wide temperature range by lattice disorder and chemical potential tuning in a (CuI) y (Bi2Te3)0.95- x (Bi2Se3) x (Bi2S3)0.05 quaternary system

Self‐Tuning N‐type Bi2(Te,Se)3/SiC Thermoelectric Nanocomposites to Realize High Performances Up to 300 °C

Transport Properties of Ni, Co, Fe, Mn Doped Cu0.01Bi2Te2.7Se0.3 for Thermoelectric Device Applications

Unlocking the Potential of Cu3SbSe3: Ultralow Thermal Conductivity and Enhanced Thermoelectric Performance

Phase Transition Behaviors and Thermoelectric Properties of CuAgTe 1– x Se x near 400 K

High-Temperature Mechanical and Thermoelectric Properties of p-Type Bi0.5Sb1.5Te3 Commercial Zone Melting Ingots

Mechanical Properties and Thermal Stability of the High-Thermoelectric-Performance Cu 2 Se Compound

Thermoelectric Cu-doped (Bi,sb)(2)te-3: Performance Enhancement and Stability Against High Electric Current Pulse

High-performance and stable AgSbTe 2 -based thermoelectric materials for near room temperature applications

Automated Instrumentation for the Determination of the High-Temperature Thermoelectric Figure-of-Merit

Measurement of non-equilibrium characteristics of thermoelectric materials

Preparation and Thermoelectric Properties of Nano-Bismuth Telluride Film by High-Temperature Thermal Shock