Thermal deformation behavior of GO/CeO2 in-situ reinforced Cu30Cr10W electrical contact material

Shengli Liang,Meng Zhou,Yi Zhang,Shuang Liu,Xu Li,Baohong Tian,Yongfeng Geng,Yijie Ban,Yanlin Jia,Yong Liu,Alex A. Volinsky
DOI: https://doi.org/10.1016/j.jallcom.2021.163266
IF: 6.2
2022-04-01
Journal of Alloys and Compounds
Abstract:Cu30Cr10W and GO/CeO2-Cu30Cr10W composites were fabricated by the spark plasma sintering (SPS). The isothermal compression tests of the Cu30Cr10W and GO/CeO2-Cu30Cr10W composites were carried out on the Gleeble-1500 thermo-mechanical simulator under the deformation temperatures of 600–900 °C and strain rates of 0.001–1 s−1. The effects of graphene doped CeO2 on the thermal deformation behavior and microstructure of the composites were investigated. The results show that a trace amount of Cr7C3 layers/nanoparticles was in-situ formed at the interface between graphene and metal matrix, and the interfacial adhesion of composites improved significantly. The Cr particles grew in strip shape perpendicular to the compression direction, and the edge of tungsten carbide particles deformed slightly. With the increased of deformation temperature from 700 ℃ to 900 ℃, the texture component changed to fiber texture. In addition, the constitutive equations of the three composites were obtained. Compared with Cu30Cr10W composites, the addition of GO/CeO2 and the accompanying twinning mechanism increased the flow stress, and the activation energy increased by 8.4% and 33.1%, respectively. Furthermore, the hot working performance is obviously improved.
materials science, multidisciplinary,chemistry, physical,metallurgy & metallurgical engineering
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