Graphene Growth by Chemical Vapour Deposition on Cross-Rolled Surface Textured Nickel-Copper Foils

Palash Chandra Maity,Narasimha Vinod Pulagara,Mamleshwar Kumar,K.N. Chaithanya Kumar,Taraknath Das,K.S. Suresh,Indranil Lahiri
DOI: https://doi.org/10.1039/d4ce00090k
IF: 3.756
2024-05-01
CrystEngComm
Abstract:The current work correlates the microstructure of multi-step cross-rolled (MSCR) and annealed polycrystalline nickel/copper (Ni/Cu) alloy with the graphene synthesis by using chemical vapor deposition (CVD). Due to the effects of higher shear stress and friction at the surface, MSCR induces significantly different texture at the surface and mid-thickness region, respectively. The transition of orientations through lattice curvature has been analyzed from electron back-scattered diffraction (EBSD). The lower stacking fault energy(SFE) of Ni/Cu alloy with higher Copper (Cu) content restricts the grain growth in annealed foils through the activation of a higher percentage of low-energy twin boundaries. Although annealing of pure Ni sample resulted in multiple variants of twinning, the 60/40:Ni/Cu alloy evolved with the highest number of twin per unit area. The essential deformation and recrystallization processes are elucidated by the alterations in strain hardening, extended recovery, and continuous recrystallization effects. The magnitudes of Cu content are correlated with the number of layers of graphene. The present study's results will motivate the article on different polycrystalline Ni/Cu alloys, with unlike surface-textures, for controlling the graphene' quality, characterized by Raman spectroscopy techniques.
chemistry, multidisciplinary,crystallography
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