Abstract:A numerical modeling study, based on 3D finite element method (FEM) simulation and 1D analytical solutions, has been carried out to evaluate the capabilities of two ac methods for measuring in-plane thermal conductivity of thin film deposited on the back of a suspended SiNx membrane setup. Two parallel metal strips are present on the top of the dielectric membrane. One strip (S1) serves as both heater and thermometer, while another one (S2) acts as thermometer only. For a modified phase shift (MPS) method, it is crucial to extract the in-plane thermal diffusivity from the phase shift of the temperature oscillation on S2. It was found that the frequency window for carrying out the data fitting became narrower as the in-plane thermal diffusivity of the composite membrane (<math>α∥,C</math>) increased, primarily due to the failure of the semi-infinite width assumption in the low frequency region. To ensure the validity of the method, the upper limit of <math>α∥,C</math> should not exceed ~1.8 × 10−5 m2 s−1 for the specific membrane dimension under consideration (1 × 1 mm2). On the other hand, inspired by a modified Ångström method proposed by Zhu recently, we suggest a new data reduction methodology which takes advantage of the phase shift on both S1 and S2 as well as the amplitude on S1. Based on the simulation results, it is expected that the non-ideality associated with the three "observables" may be at least partially canceled out. Therefore, the frequency window selection for carrying out the data fitting is not sensitive to the magnitude of <math>α∥,C</math> and the upper limit of measurable <math>αC,∥</math> can be further increased with respect to the MPS method. For typical specimen films whose in-plane thermal conductivity ranges from 0.84 W m−1 K−1 to 50 W m−1 K−1, the method proposed here yields a theoretical measurement uncertainty of less than 5%.

Studying the Effect of a Thermocouple Contact with the Surface of a Thin Sample with Low Thermal Conductivity on the Accuracy of Temperature Determination

Design and Testing of a Micro Thermal Sensor for Non-Contact Surface Defect Detection.

Research on Dynamic Artificial Thermocouple Method

A High-Precision Instrumentation of Measuring Thermal Contact Resistance Using Reversible Heat Flux

Error correction for temperature measurement in insulating material: Application to the aluminum electrolysis cell

An improved steady-state method for measuring the thermal contact resistance and bulk thermal conductivity of thin-walled materials having a sub-millimeter thickness

Thermomechanical analysis of the effect of contact forces in heat conduction of composite materials through multiscale contact finite element modeling

A high-precision method to measure thermal conductivity of solids using reversible heat flux

Simultaneous Measurement of Thermal Conductivity and Volumetric Heat Capacity of Thermal Interface Materials Using Thermoreflectance

Experimental Investigation of High Temperature Thermal Contact Resistance of Thin Disk Samples Using Infrared Camera in Vacuum Condition

Determination on the thermal conductivity and thermal contact resistance of thin composite phase change films as a thermal interfacial material

Measurement Techniques for Thermal Conductivity and Interfacial Thermal Conductance of Bulk and Thin Film Materials

Numerical study of thermal contact resistance considering spots and gap conduction effects

Study Of Non-Contact Measurement Of The Thermal Expansion Coefficients Of Materials Based On Laser Feedback Interferometry

Analysis and Improvement of the Hot Disk Transient Plane Source Method for Low Thermal Conductivity Materials

Heat transfer error analysis of high-temperature wall temperature measurement using thermocouple

A three-probe method for accurate nanoscale thermal transport measurements

Development and Assessment of a Miniaturized Thermocouple for Precise Temperature Measurement in Biological Tissues and Cells

Reducing the Possibility of Subjective Error in the Determination of the Structure-Function-Based Effective Thermal Conductivity of Boards

Research on a dedicated thin-film thermocouple testing system for transient temperature measurement

Numerical modeling of in-plane thermal conductivity measurement methods based on a suspended membrane setup