Role of graphene surface coating of DBC substrate on sintering motion behavior of copper nanoparticles for silicon carbide power devices

Jiaxin Liu,Weishan Lv,Suhang Wei,Songying Zhao
DOI: https://doi.org/10.1140/epjp/s13360-024-05149-4
2024-04-28
The European Physical Journal Plus
Abstract:Due to the easy oxidation and limited heat dissipation performance of directly bonded copper (DBC) substrate, it is unable to meet the needs of silicon carbide (SiC) high-power devices. Graphene is considered to possess enormous potential in the field of SiC device packaging and interconnection because of its high thermal conductivity and stable physical properties. Graphene coating could suppress the oxidation of the Cu layer, which improves the interconnection reliability between die-attach material and substrate. However, there is currently a lack of research on the interaction mechanism between graphene coatings and die-attach material, which is not conducive to application in SiC devices. In this work, molecular dynamics (MD) simulation was performed to investigate the sintering behavior of Cu nanoparticles on graphene-coated direct bonded copper (DBC) substrate for the first time. The motion modes of Cu nanoparticles under different graphene nanoribbon spacing, thickness, and arrangement directions were analyzed. Different sintering temperatures and particle diameters were employed to reveal the relationship between sintering driving force and van der Waals force. High sintering temperatures and small particle diameters can cause rapid oscillation of particles, which accelerates the completion of the sintering process. when the sintering direction of the particles is consistent with the arrangement direction of graphene nanoribbons, graphene can play a role in promoting the sintering process. Overall, this work provides theoretical support for the application of graphene in DBC substrate, aiming to improve the mechanical reliability and heat dissipation performance of SiC power devices.
physics, multidisciplinary
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