Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Ying Wang,Yuan Gao,Bo Tang,Xinfeng Wu,Jin Chen,Liming Shan,Kai Sun,Yuantao Zhao,Ke Yang,Jinhong Yu,Wenge Li

DOI: https://doi.org/10.1039/d1ra04602k

IF: 4.036

2021-01-01

RSC Advances

Abstract:As electronic devices tend to be integrated and high-powered, thermal conductivity is regarded as the crucial parameter of electronic components, which is the main factor that limits the operating speed and service lifetime of electronic devices.

chemistry, multidisciplinary

What problem does this paper attempt to address?

The paper aims to address the heat dissipation issues arising from the high integration and high power of electronic devices. Specifically, the research team prepared an epoxy resin composite (BN/CF/EP) with high thermal conductivity by constructing a three-dimensional oriented carbon fiber (3D-oriented carbon fiber, CF) and boron nitride (BN) network structure. The core issue of the paper is to find a simple and efficient method to construct a three-dimensional oriented network structure and improve thermal conductivity without significant gaps between adjacent fillers. Experimental results show that with 5 volume percent of 10 mm long carbon fibers and 40 volume percent of boron nitride filling, the prepared composite material achieves a thermal conductivity of up to 3.1 W/m·K while maintaining good electrical insulation properties. This research finding has significant application potential for thermal management materials in the microelectronics field and aerospace industry.