Abstract:An innovative filler framework, featuring a vertically aligned macro‐level carbon fiber array interconnected by a high‐quality, self‐assembled graphene network, is developed, enabling atomic‐level thermal conduction continuity in composites. The resulting epoxy composite achieves an unprecedented through‐plane thermal conductivity of 262 W m−1 K−1 with excellent Joule heating and interfacial adhesion properties, making it ideal for multifunctional thermal management applications. Thermally conductive polymer composites hold great potential for thermal management applications in the electronics industry, but achieving metal‐like thermal conductivity (>200 W m−1 K−1) remains challenging due to the inevitable phonon scattering and the thermal resistance at filler‐filler and filler‐matrix interfaces. Herein, an efficient approach is presented to overcome this long‐standing barrier by designing a densified interconnecting filler framework, featuring a macro‐level carbon fiber (CF) array welded with a high‐quality, self‐assembled graphene network. In this framework, vertically aligned continuous CFs function as primary through‐plane thermal conduction paths, minimizing phonon scattering and thermal resistance. Meanwhile, the secondary graphene network interconnects the CFs into a more integrated and densified framework while introducing supplementary thermal conduction paths. Following polymer backfilling, the resulting epoxy nanocomposite exhibits an unprecedented through‐plane thermal conductivity of 262 W m−1 K−1 at a filler loading of 23.3 vol%, establishing a new benchmark among the thermally conducting polymer composites. When employed as a thermal interface material, this composite offers a 68.2% enhancement in cooling efficiency compared to standard commercial counterparts. Furthermore, the functional composite presents excellent Joule heating and interfacial adhesion properties, making it promising for thermal interface healing and multifunctional thermal management applications in complex environments.

Carbon Fiber/Phenolic Composites with High Thermal Conductivity Reinforced by a Three-Dimensional Carbon Fiber Felt Network Structure

Fabrication of Three-dimensional Thermally Conductive Carbon Fibers/Carbon Nanotubes Network Reinforce Epoxy Composites

3D Thermal Network Supported by CF Felt for Improving the Thermal Performance of CF/C/Epoxy Composites

Effects of Carbon Nanotubes and Carbon Fiber Reinforcements on Thermal Conductivity and Ablation Properties of Carbon/phenolic Composites

Epoxy Composites with High Thermal Conductivity by Constructing Three-Dimensional Carbon Fiber/Carbon/Nickel Networks Using an Electroplating Method

Optimizing the Thermal Properties of Fiber Reinforced Phthalonitrile Composites

Epoxy composite with high thermal conductivity by constructing 3D-oriented carbon fiber and BN network structure

Preparation, Properties and Mechanisms of Carbon Fiber/Polymer Composites for Thermal Management Applications

Enhanced thermal conductivity and isotropy of polymer composites by fabricating 3D network structure from carbon‐based materials

Densifying Conduction Networks of Vertically Aligned Carbon Fiber Arrays with Secondary Graphene Networks for Highly Thermally Conductive Polymer Composites

Ultrahigh thermal conductive polymer composites by the 3D printing induced vertical alignment of carbon fiber

High thermal and mechanical properties of carbon fiber network reinforced copper matrix composites achieved by configuration design and interface engineering

Thermal conductivity enhancement of carbon fiber/epoxy composites via constructing three-dimensionally aligned hybrid thermal conductive structures on fiber surfaces

The Microstructure and Thermal Conductive Behavior of Three-Dimensional Carbon/Carbon Composites with Ultrahigh Thermal Conductivity

Thermal conductive nylon 6 composites using hybrid fillers to construct a three‐dimensional thermal conductive network

The through-thickness thermal conductivity and heat transport mechanism of carbon fiber three-dimensional orthogonal woven fabric composite

Microstructure and thermal properties of copper matrix composites reinforced by 3D carbon fiber networks

Epoxy composites with high cross-plane thermal conductivity by constructing all-carbon multidimensional carbon fiber/graphite networks

Preparation, microstructure and properties of three-dimensional carbon/carbon composites withhigh thermal conductivity

High Thermal Conductive Poly(vinylidene Fluoride)-Based Composites with Well-Dispersed Carbon Nanotubes/graphene Three-Dimensional Network Structure Via Reduced Interfacial Thermal Resistance

Graphite films/carbon fiber fabric/polyurethane composites with ultrahigh in-plane thermal conductivity and enhanced mechanical properties