Abstract:The increasing demand for designing and manufacturing micro parts with high quality comes from the high speed development of micro electromechanical systems (MEMS) and nano electromechanical systems (NEMS) in recent years. Nanometric cutting as an important machining way of micro parts has become a hot spot in machining field. Some main issues in nanometric cutting such as chip formation, machined surface quantity and diamond tool wear etc., have been investigated by molecular dynamics. Previous researchers have pointed out that, the generation and evolution of defects are mainly, responsible for causing plastic deformation of machined workpiece in nanometric cutting of plastic materials and a high compressive stress remaining in shear zone is considered beneficial to ductile-mode machining of brittle materials. Up to now, however, the influence of cutting thickness on defect behaviors and stress distribution in a workpiece and the relationship between them for single crystal materials are still unclear. In the present study, molecular dynamics simulations of nanometric cutting of single crystal Cu were performed. The simulation results show that stacking fault and partial dislocation are two main types of the defects in workpieces. A high surface stress at the atomic scale was observed in workpieces and there exist the compressive stress in shear zones and tensile stresses in the machined surfaces. It is found that the stress-distance curves of workpieces present a clear periodicity corresponding to the generation and evolution of dislocations in them. At the beginning of cutting (a small cutting thickness), no apparent stacking faults inside workpieces have been found, but with the increase of cutting thickness, the defects on surfaces and subsurfaces increase significantly and the thicker the cutting thickness, the smaller the corresponding stress components.

Material deformation mechanism of polycrystalline tin in nanometric cutting

Atomic simulation for the effect of nano-cutting parameters on the 3D surface morphology of polycrystalline γ-TiAl alloy

Grain Refinement Mechanism under High Strain-Rate Deformation in Machined Surface During High Speed Machining Ti6Al4V

Material Removal Behavior of Nanoscale Shear Cutting and Extrusion Cutting of Monocrystalline Γ-Tial Alloy

Numerical simulation of nano-cutting behaviors for polycrystalline γ-TiAl alloy: The effect of grain sizes

Effects of microstructures on the material removal mechanisms in nanomachining of polycrystalline materials

Numerical Investigation on the Temperature Effect in Nanometric Cutting of Polycrystalline Silicon

Simulation Study of Material Deformation in Monocrystal Silicon Nano-Machining

Sub-nanometer finishing of polycrystalline tin by inductively coupled plasma-assisted cutting

Effect of Grain Size on Nanometric Cutting of Polycrystalline Silicon via Molecular Dynamics Simulation

Molecular Dynamics Simulation of Nanometric Cutting of Polycrystalline Copper

MOLECULAR DYNAMICS SIMULATION OF NANOMETRIC CUTTING CHARACTERISTICS OF SINGLE CRYSTAL Cu

Molecular dynamics simulation study of interaction mechanism between grain boundaries and subgrain boundaries in nano-cutting

Study of Materials Deformation in Nanometric Cutting by Large-scale Molecular Dynamics Simulations

Towards an Understanding of Grain Boundary Step in Diamond Cutting of Polycrystalline Copper

Molecular dynamics simulation of cutting mechanism of polycrystalline Fe-Cr-W alloy

Atomistic Simulation Study of Nanoparticle Effect on Nano-Cutting Mechanisms of Single-Crystalline Materials

Molecular Dynamics Analysis Micro-Mechanism Of Ductile Machining Single Crystal Silicon By Means Of Nanometric Cutting Technology

Subsurface Deformation Mechanism in Nano-cutting of Gallium Arsenide Using Molecular Dynamics Simulation

Molecular Dynamics Simulation of Subsurface Deformed Layers in Nanometric Cutting Using Atomic Force Microscope Pin Tool

Crystal plasticity finite element modeling and simulation of diamond cutting of polycrystalline copper