Semiconductor fibres for textile integrated electronic system

Yuanyuan Zheng,Zhen Wang,Peining Chen,Huisheng Peng

DOI: https://doi.org/10.1093/nsr/nwae143

IF: 20.6

2024-04-15

National Science Review

Abstract:This article gives an overview of current preparation technologies and future research directions for the emerging smart semiconductor fibres.

multidisciplinary sciences

What problem does this paper attempt to address?

The problem that this paper attempts to solve is to develop semiconductor fibers that can meet the requirements of high performance and high integration, in order to realize textile - integrated electronic systems. Specifically, the paper focuses on the following aspects:

1. **Limitations of Functional Clothing**: The functions of traditional clothing are mainly limited to keeping warm and covering the body. With the development of smart fibers, fabrics are expected to achieve revolutionary multidisciplinary applications in fields such as smart healthcare and the Internet of Things. However, current information processing mainly depends on relatively large chips and circuits, which pose challenges to wearability and stability.

2. **Preparation Technologies of Semiconductor Fibers**: In order to improve the performance and integration density of semiconductor fibers, it is necessary to overcome the technical difficulties of lithography and deposition - stripping processes on curved - surface fibers. The paper discusses the development of rotary lithography technology and contour fiber lithography technology, and how these technologies solve the curved - surface processing problems.

3. **Preparation Methods of Continuous Long Semiconductor Fibers**: In order to obtain continuous and long semiconductor fibers, researchers have developed coating methods and melt - core methods. These methods can be used to prepare semiconductor fibers based on materials such as conjugated polymers, quantum dots, and metal - oxide nanoparticles. In particular, the melt - core method can produce single - core or multi - core inorganic fibers (such as silicon - and germanium - based fibers) hundreds of meters long, but achieving complex structures and efficient information processing remains a challenge.

4. **Future Research Directions**:
- **Optimizing the Performance of Semiconductor Fibers**: Improve the flexibility and integration of semiconductor fibers by designing new materials and advanced structures.
- **Increasing the Integration Level**: Develop micro - and nano - manufacturing technologies suitable for fiber curved surfaces, and increase the density of functional units in the axial and radial directions.
- **Achieving Mass Production**: Improve the engineered fiber lithography production line to produce longer semiconductor fibers while ensuring device integration and performance.
- **Enhancing the Stability of Use and Post - Processing**: Improve the stability of semiconductor fibers under various environmental conditions through effective mechanical design and packaging processes.

In summary, this paper aims to explore the existing semiconductor fiber preparation technologies and look forward to future research directions, in order to achieve flexible, highly integrated, multi - functional, mass - produced, and stable semiconductor fibers, and ultimately realize the functions of data reception, processing, and transmission, so that they can be stably woven into a full - textile electronic system without a large number of chips and circuits.